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MRT2-8011CAG6A PDF预览

MRT2-8011CAG6A

更新时间: 2024-11-17 01:55:51
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
90页 1815K
描述
i.MX RT1024 Crossover Processors Data Sheet for Consumer Products

MRT2-8011CAG6A 数据手册

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Document Number: IMXRT1024CEC  
Rev. 0, 11/2020  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1024DAG5A  
i.MX RT1024 Crossover  
Processors Data Sheet  
for Consumer Products  
Package Information  
Plastic Package  
144-Pin LQFP, 20 x 20 mm, 0.5 mm pitch  
Ordering Information  
See Table 2 on page 6  
1 i.MX RT1024 introduction  
The i.MX RT1024 is a processor of i.MX RT family  
featuring NXP’s advanced implementation of the Arm  
1. i.MX RT1024 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6  
1.3. Package marking information . . . . . . . . . . . . . . . . 8  
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.1. Special signal considerations . . . . . . . . . . . . . . . 16  
3.2. Recommended connections for unused analog  
®
®
Cortex -M7 core, which operates at speeds up to 500  
MHz to provide high CPU performance and real-time  
response.  
The i.MX RT1024 processor has 4 MB on-chip flash.  
256 KB on-chip RAM can be flexibly configured as  
TCM or general-purpose on-chip RAM. The i.MX  
RT1024 integrates advanced power management module  
with DCDC and LDO that reduces complexity of  
external power supply and simplifies power sequencing.  
The i.MX RT1024 also provides various memory  
interfaces, including SDRAM, RAW NAND FLASH,  
NOR FLASH, SD/eMMC, Quad SPI, and a wide range  
of connectivity interfaces including UART, SPI, I2C,  
USB, and CAN; for connecting peripherals including  
WLAN, Bluetooth™, and GPS. The i.MX RT1024 also  
has rich audio features, including SPDIF and I2S audio  
interface. Various analog IP integration, including ADC,  
analog comparator, temperature sensor, etc.  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18  
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 18  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 23  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 35  
4.5. External memory interface . . . . . . . . . . . . . . . . . 40  
4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53  
4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 60  
4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72  
5. Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74  
6. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 75  
6.1. Boot mode configuration pins . . . . . . . . . . . . . . . 75  
6.2. Boot device interface allocation . . . . . . . . . . . . . . 75  
7. Package information and contact assignments . . . . . . . 80  
7.1. 20 x 20 mm package information . . . . . . . . . . . . 80  
8. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89  
NXP reserves the right to change the production detail specifications as may be required  
to permit improvements in the design of its products.  

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