™
Metal Glaze High Power
Density Surface Mount
Power Resistor
MRC Series
Metal Glaze™ thick film
element fired at 1000°C to
solid ceramic substrate
• 1/2 watt in 1/8 watt package
• 1 watt in 1/2 watt package (2010 footprint)
• MRC1/2: 0.05 Ω to 1.0 Ω
(contact factory for higher values)
• 150°C maximum operating temperature
• Superior surge handling capability
High temperature
dielectric coating
60/40 Solder over nickel barrier
Environmental Data
Size
Industry
IRC
Max.
Working
Max.
Resistance
Tolerance
(±%)3
TCR
Product
Catagory
Code1 Footprint Type Power Rating Voltage2 Voltage Range (ohms)3
(ppm/°C)3
0.1 to 0.99
1,2,5
1,2,5
100
50,100
50,100
200
Low Range
Standard
C
E
1206
2010
MRC1/2
MRC1
1/2W @ 70°C
1W @ 70°C
200
350
400
700
1.0 to 10K
20 to 10K
0.25, 0.5
2,5
Tight Tolerance
Low Range
Low Range
0.05 to 0.099
0.10 to 1.0
1,2,5
100
MRC Applications:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on
a 2010 footprint. The MRC is recommended for applications where board real estate is a major concern. Due
to high power density and superior surge handling capability, it is also recommended as a direct replacement on
existing board designs where standard 1206 and 2010 resistors are marginal or failing.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Maximum Change
As specified
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
Low Temperature Operation
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
Short Time Overload
±(1.0% + 0.01Ω)
±(0.5% + 0.01Ω)
2.5 x PxR for 5 seconds
√
High Temperature Exposure
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
Resistance to Bonding Exposure ±(0.25% + 0.01Ω)
Solderability
Moisture Resistance
Life Test
95% minimum coverage
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
1200 gram push from underside of mounted chip
for 60 seconds
Terminal Adhesion Strength
±(1% + 0.01Ω)
no mechanical damage
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
Resistance to Board Bending
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
© IRC Wirewound and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
MRC Series Issue June 2008 Sheet 1 of 2