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MRC1-100-1000-G-7

更新时间： 2024-10-05 05:50:11
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Metal Glaze High Power Density Surface Mount Power Resistor

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™
Metal Glaze High Power  
Density Surface Mount  
Power Resistor  
MRC Series  
Metal Glaze™ thick film  
element fired at 1000°C to  
solid ceramic substrate  
• 1/2 watt in 1/8 watt package  
• 1 watt in 1/2 watt package (2010 footprint)  
• MRC1/2: 0.05 Ω to 1.0 Ω  
(contact factory for higher values)  
• 150°C maximum operating temperature  
• Superior surge handling capability  
High temperature  
dielectric coating  
60/40 Solder over nickel barrier  
Environmental Data  
Size  
Industry  
IRC  
Max.  
Working  
Max.  
Resistance  
Tolerance  
(±%)3  
TCR  
Product  
Catagory  
Code1 Footprint Type Power Rating Voltage2 Voltage Range (ohms)3  
(ppm/°C)3  
0.1 to 0.99  
1,2,5  
1,2,5  
100  
50,100  
50,100  
200  
Low Range  
Standard  
C
E
1206  
2010  
MRC1/2  
MRC1  
1/2W @ 70°C  
1W @ 70°C  
200  
350  
400  
700  
1.0 to 10K  
20 to 10K  
0.25, 0.5  
2,5  
Tight Tolerance  
Low Range  
Low Range  
0.05 to 0.099  
0.10 to 1.0  
1,2,5  
100  
MRC Applications:  
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on  
a 2010 footprint. The MRC is recommended for applications where board real estate is a major concern. Due  
to high power density and superior surge handling capability, it is also recommended as a direct replacement on  
existing board designs where standard 1206 and 2010 resistors are marginal or failing.  
Environmental Data  
Characteristics  
Temperature Coefficient  
Thermal Shock  
Maximum Change  
As specified  
Test Method  
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)  
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)  
±(0.5% + 0.01Ω)  
±(0.25% + 0.01Ω)  
Low Temperature Operation  
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)  
MIL-R-55342E Par 4.7.5  
Short Time Overload  
±(1.0% + 0.01Ω)  
±(0.5% + 0.01Ω)  
2.5 x PxR for 5 seconds  
√
High Temperature Exposure  
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)  
MIL-R-55342E Par 4.7.7  
(Reflow soldered to board at 260°C for 10 seconds)  
Resistance to Bonding Exposure ±(0.25% + 0.01Ω)  
Solderability  
Moisture Resistance  
Life Test  
95% minimum coverage  
MIL-STD-202, Method 208 (245°C for 5 seconds)  
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)  
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)  
±(0.5% + 0.01Ω)  
±(1.0% + 0.01Ω)  
±(1% + 0.01Ω)  
no mechanical damage  
1200 gram push from underside of mounted chip  
for 60 seconds  
Terminal Adhesion Strength  
±(1% + 0.01Ω)  
no mechanical damage  
Chip mounted in center of 90mm long board, deflected 5mm  
so as to exert pull on chip contacts for 10 seconds  
Resistance to Board Bending  
General Note  
IRC reserves the right to make changes in product specification without notice or liability.  
All information is subject to IRC’s own data and is considered accurate at time of going to print.  
A subsidiary of  
TT electronics plc  
© IRC Wirewound and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA  
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com  
MRC Series Issue June 2008 Sheet 1 of 2  
12

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