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MR756 PDF预览

MR756

更新时间: 2024-11-14 03:48:27
品牌 Logo 应用领域
DEC 二极管
页数 文件大小 规格书
1页 83K
描述
25 AMP LEAD MOUNT BUTTON DIODES

MR756 数据手册

  
DIOTEC ELECTRONICS CORP  
Looking For: MR750, MR751, MR752,  
MR754, MR756 Replacements?  
25 AMP LEAD MOUNT BUTTON DIODES  
MECHANICAL SPECIFICATION  
FEATURES  
SUGGESTED REPLACEMENT FOR MR751, MR752,  
MR754, MR756 DIODES  
Die Size:  
0.165" x 0.165"  
Square  
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM  
MECHANICAL STRENGTH AND HEAT DISSIPATION  
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)  
LARGE DIE FOR HIGH POWER HEAVY DUTY  
PERFORMANCE  
HIGH HEAT HANDLING CAPABILITY WITH VERY  
LOW THERMAL STRESS  
MILLIMETERS  
MIN  
MAX  
INCHES  
MIN  
DIM  
MAX  
PROPRIETARY JUNCTION PASSIVATION FOR  
SUPERIOR RELIABILITY AND PERFORMANCE  
A
B
D
E
0.332 0.342  
0.234 0.246  
0.050 0.053  
0.215 0.225  
LOW FORWARD VOLTAGE DROP  
MECHANICAL DATA  
F
L
0.165  
0.990  
0.175  
1.010  
M
5° NOM  
5° NOM  
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS  

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