Datasheet > MPX2301D

MPX2301D

更新时间： 2024-03-03 10:08:49

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
7页	100K
描述
CHIP PAK

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数据手册

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MPX2301D 数据手册

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: MPX2300DT1

Rev. 11, 09/2015

MPX2300DT1, 0 to 40 kPa, Differential

Compensated Pressure Sensor

MPX2300DT1

Freescale Semiconductor has developed a high volume, miniature pressure

sensor package which is ideal as a sub-module component or a disposable unit.

The unique concept of the Chip Pak allows great flexibility in system design while

providing an economic solution for the designer. This new chip carrier package

uses Freescale Semiconductor's unique sensor die with its piezoresistive

technology, along with the added feature of on-chip, thin-film temperature

compensation and calibration.

Chip Pak package

Back view

Features

•

Integrated temperature compensation and calibration

Ratiometric to supply voltage

Polysulfone case material (ISO 10993)

Provided in easy-to-use tape and reel

MPX2300DT1

Case 98ASB13355C

Typical applications

•

Medical diagnostics

Front view

Infusion pumps

Blood pressure monitors

Pressure catheter applications

Patient monitoring

1 2 3 4

NOTE

The die and wire bonds are exposed on the front side of the chip

pak (pressure is applied to the backside of the device). Front

side die and wire protection must be provided in the customer's

housing. Use caution when handling the devices during all

processes.

Pinout

Ordering information

Pressure type

Differential

Device name

Shipping

Package

Device marking

Absolute

Gauge

XXXX = Device code

XXX = Trace code

MPX2300DT1

Tape and Reel

98ASB13355C

•

Freescale reserves the right to change the detail specifications as may be required to permit

improvements in the design of its products.

12 3 4 5 6 7

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