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MPSH10_07 PDF预览

MPSH10_07

更新时间: 2024-10-01 03:40:55
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
3页 83K
描述
VHF/UHF Transistors NPN Silicon

MPSH10_07 数据手册

 浏览型号MPSH10_07的Datasheet PDF文件第2页浏览型号MPSH10_07的Datasheet PDF文件第3页 
MPSH10  
Preferred Device  
VHF/UHF Transistors  
NPN Silicon  
Features  
PbFree Packages are Available*  
http://onsemi.com  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
1
CollectorEmitter Voltage  
V
CEO  
V
CBO  
V
EBO  
25  
Vdc  
BASE  
CollectorBase Voltage  
EmitterBase Voltage  
30  
Vdc  
Vdc  
3.0  
2
EMITTER  
Total Device Dissipation @ T = 25°C  
P
D
350  
2.8  
W
mW/°C  
A
Derate above 25°C  
Total Device Dissipation @ T = 25°C  
P
D
1.0  
8.0  
W
mW/°C  
C
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
55 to +150  
°C  
J
stg  
THERMAL CHARACTERISTICS  
TO92  
CASE 2911  
STYLE 2  
Characteristic  
Symbol  
Max  
200357  
125  
Unit  
°C/W  
°C/W  
1
2
3
Thermal Resistance, JunctiontoAmbient  
Thermal Resistance, JunctiontoCase  
R
q
JA  
R
q
JC  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
MARKING DIAGRAM  
MPS  
H10  
AYWW G  
G
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
February, 2007 Rev. 3  
MPSH10/D  

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