是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | PLASTIC, BGA-357 | 针数: | 357 |
Reach Compliance Code: | not_compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.48 |
Is Samacsys: | N | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B357 |
JESD-609代码: | e0 | 长度: | 25 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 357 | 最高工作温度: | 100 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA357,19X19,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 220 | 电源: | 1.8,3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.52 mm |
速度: | 100 MHz | 子类别: | Microprocessors |
最大供电电压: | 1.9 V | 最小供电电压: | 1.7 V |
标称供电电压: | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MPC859TCVR100A | NXP |
完全替代 |
32-BIT, 100MHz, RISC PROCESSOR, PBGA357, LEAD FREE, PLASTIC, BGA-357 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC859TTS | MOTOROLA |
获取价格 |
PowerQUICC⑩ Family Technical Summary | |
MPC859TTSD | MOTOROLA |
获取价格 |
PowerQUICC⑩ Family Technical Summary | |
MPC859TVR100A | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC859TVR100A | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 100MHz, Communications Processor, 0 to 95C | |
MPC859TVR133A | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC859TVR133A | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 133MHz, Communications Processor, 0 to 95C | |
MPC859TZP100 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC859TZP100A | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC859TZP100A | NXP |
获取价格 |
32-BIT, 100MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
MPC859TZP133 | FREESCALE |
获取价格 |
Hardware Specifications |