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MPC8313ZQAFF PDF预览

MPC8313ZQAFF

更新时间: 2024-10-01 19:54:59
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
99页 729K
描述
32-BIT, 333MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516

MPC8313ZQAFF 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
针数:516Reach Compliance Code:not_compliant
ECCN代码:5A992HTS代码:8542.31.00.01
风险等级:5.31其他特性:ALSO REQUIRES 3.3V I/O SUPPLY
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:66.67 MHz
外部数据总线宽度:32格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B516
JESD-609代码:e0长度:27 mm
低功率模式:YES湿度敏感等级:3
端子数量:516封装主体材料:PLASTIC/EPOXY
封装代码:HBGA封装形状:SQUARE
封装形式:GRID ARRAY, HEAT SINK/SLUG峰值回流温度(摄氏度):225
认证状态:Not Qualified座面最大高度:2.55 mm
速度:333 MHz最大供电电压:1.5 V
最小供电电压:0.95 V标称供电电压:1 V
表面贴装:YES技术:CMOS
端子面层:Tin/Lead/Silver (Sn/Pb/Ag)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:27 mm
uPs/uCs/外围集成电路类型:MICROPROCESSORBase Number Matches:1

MPC8313ZQAFF 数据手册

 浏览型号MPC8313ZQAFF的Datasheet PDF文件第2页浏览型号MPC8313ZQAFF的Datasheet PDF文件第3页浏览型号MPC8313ZQAFF的Datasheet PDF文件第4页浏览型号MPC8313ZQAFF的Datasheet PDF文件第5页浏览型号MPC8313ZQAFF的Datasheet PDF文件第6页浏览型号MPC8313ZQAFF的Datasheet PDF文件第7页 
Document Number: MPC8313EEC  
Rev. 4, 11/2011  
Freescale Semiconductor  
Datasheet: Technical Data  
MPC8313E  
PowerQUICC II Pro Processor  
Hardware Specifications  
Contents  
This document provides an overview of the MPC8313E  
PowerQUICC™ II Pro processor features, including a block  
diagram showing the major functional components. The  
MPC8313E is a cost-effective, low-power, highly integrated  
host processor that addresses the requirements of several  
printing and imaging, consumer, and industrial applications,  
including main CPUs and I/O processors in printing systems,  
networking switches and line cards, wireless LANs  
(WLANs), network access servers (NAS), VPN routers,  
intelligent NIC, and industrial controllers. The MPC8313E  
extends the PowerQUICC™ family, adding higher CPU  
performance, additional functionality, and faster interfaces  
while addressing the requirements related to time-to-market,  
price, power consumption, and package size.  
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6  
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11  
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13  
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14  
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
8. Ethernet: Three-Speed Ethernet, MII Management . 21  
9. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 36  
10. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
11. Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 47  
12. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
13. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
14. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
15. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
16. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59  
17. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61  
18. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61  
19. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 63  
20. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
21. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82  
22. System Design Information . . . . . . . . . . . . . . . . . . . 87  
23. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 93  
24. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95  
NOTE  
The information in this document is accurate for  
revisions 1.0, 2.x, and later. See Section 23.1, “Part  
Numbers Fully Addressed by this Document.”  
© Freescale Semiconductor, Inc., 2007–2011. All rights reserved.  

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