Document Number: MPC8313EEC
Rev. 3, 01/2009
Freescale Semiconductor
Technical Data
MPC8313E
PowerQUICC II Pro Processor
Hardware Specifications
™
Contents
This document provides an overview of the MPC8313E
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
PowerQUICC™ II Pro processor features, including a block
diagram showing the major functional components. The
MPC8313E is a cost-effective, low-power, highly integrated
host processor that addresses the requirements of several
printing and imaging, consumer, and industrial applications,
including main CPUs and I/O processors in printing systems,
networking switches and line cards, wireless LANs
(WLANs), network access servers (NAS), VPN routers,
intelligent NIC, and industrial controllers. The MPC8313E
extends the PowerQUICC™ family, adding higher CPU
performance, additional functionality, and faster interfaces
while addressing the requirements related to time-to-market,
price, power consumption, and package size.
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8. Ethernet: Three-Speed Ethernet, MII Management . 21
9. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 36
10. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
11. Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 47
12. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
13. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
14. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
15. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
16. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
17. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
18. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
19. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 63
20. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
21. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
22. System Design Information . . . . . . . . . . . . . . . . . . . 88
23. Document Revision History . . . . . . . . . . . . . . . . . . . 94
24. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 97
NOTE
The information in this document is accurate for
revisions 1.0, 2.x, and later. See Section 24.1, “Part
Numbers Fully Addressed by this Document.”
© Freescale Semiconductor, Inc., 2007–2009. All rights reserved.