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MPC8275ZQMIB PDF预览

MPC8275ZQMIB

更新时间: 2024-11-30 04:43:55
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
76页 1270K
描述
Micro Peripheral IC, CMOS, PBGA516,

MPC8275ZQMIB 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:BGA, BGA516,26X26,40Reach Compliance Code:unknown
风险等级:5.73JESD-30 代码:S-PBGA-B516
端子数量:516最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA516,26X26,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.5,3.3 V认证状态:Not Qualified
子类别:Other uPs/uCs/Peripheral ICs表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOMBase Number Matches:1

MPC8275ZQMIB 数据手册

 浏览型号MPC8275ZQMIB的Datasheet PDF文件第2页浏览型号MPC8275ZQMIB的Datasheet PDF文件第3页浏览型号MPC8275ZQMIB的Datasheet PDF文件第4页浏览型号MPC8275ZQMIB的Datasheet PDF文件第5页浏览型号MPC8275ZQMIB的Datasheet PDF文件第6页浏览型号MPC8275ZQMIB的Datasheet PDF文件第7页 
Technical Data  
MPC8280EC  
Rev. 1.0, 2/2004  
MPC8280  
PowerQUICC II™ Family  
Hardware Specifications  
This document contains detailed information about power considerations, DC/AC electrical  
characteristics, and AC timing specifications for .13µm (HiP7) members of the  
PowerQUICC II™ family of integrated communications processors—the MPC8280, the  
MPC8275, and the MPC8270 (collectively called 'the MPC8280' throughout this document ).  
The following topics are addressed:  
Topic  
Page  
2
Section 1, “Overview”  
Section 2, “Operating Conditions”  
Section 3, “DC Electrical Characteristics”  
Section 4, “Thermal Characteristics”  
Section 5, “Power Dissipation”  
Section 6, “AC Electrical Characteristics”  
Section 7, “Clock Configuration Modes”  
Section 8, “Pinout”  
7
8
11  
13  
13  
22  
40  
70  
73  
73  
Section 9, “Package Description”  
Section 10, “Ordering Information”  
Section 11, “Document Revision History”  

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