Datasheet > MP23ABS1

MP23ABS1

更新时间： 2024-11-29 14:57:27

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		传感器
页数	文件大小	规格书
15页	563K
描述
高性能MEMS音频传感器单端模拟底开孔麦克风

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MP23ABS1 数据手册

MP23ABS1

High-performance MEMS audio sensor:

single-ended analog bottom-port microphone

Datasheet - production data

Description

The MP23ABS1 is a compact, low-power

microphone built with a capacitive sensing

element and an IC interface.

The sensing element, capable of detecting

acoustic waves, is manufactured using a

specialized silicon micromachining process to

produce audio sensors.

The MP23ABS1 has an acoustic overload point of

130 dBSPL with a typical 64 dB signal-to-noise

ratio.

RHLGA metal cap 5-lead

3.5 x 2.65 x 0.98 mm

The sensitivity of the MP23ABS1 is -38 dBV

±1 dB @ 94 dBSPL, 1 kHz.

The MP23ABS1 is available in a package

compliant with reflow soldering and is guaranteed

to operate over an extended temperature range

from -40 °C to +85 °C.

Features

 Single supply voltage operation 1.52 V - 3.6 V

 Omnidirectional sensitivity

 High signal-to-noise ratio

Applications

 High acoustic overload point: 130 dBSPL typ.

 Package compliant with reflow soldering

 Enhanced RF immunity

 Mobile phones

 Wearables

 Hearables

 Ultra-flat frequency response

 Low latency

 Smart speakers

 Active noise-canceling headsets

 Ultra-low-power: 150 μA max

 ECOPACK, RoHS, and “Green” compliant

Table 1. Device summary

Order code

Temperature range (C)

Package

Packing

MP23ABS1

-40 to +85

(3.5 x 2.65 x 0.98) mm

Tray

MP23ABS1TR

Tape and reel

October 2020

DocID031167 Rev 6

1/15

This is information on a product in full production.

www.st.com

12 3 4 5 6 7...15

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