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MMXZ5242B-T PDF预览

MMXZ5242B-T

更新时间: 2024-11-17 08:43:39
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
5页 731K
描述
Zener Diode,

MMXZ5242B-T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.68
JESD-609代码:e0湿度敏感等级:1
端子面层:Tin/Lead (Sn/Pb)Base Number Matches:1

MMXZ5242B-T 数据手册

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MMXZ5221B  
THRU  
MMXZ5259B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
200 mW  
l
l
l
l
Planar Die construction  
200mW Power Dissipation  
Zener Diodes  
2.4 to 39 Volts  
Zener Voltages from 2.4V - 39V  
Ideally Suited for Automated Assembly Processes  
Mechanical Data  
SOD323  
Case Material: Molded Plastic. UL Flammability  
l
Classification Rating 94V-0  
A
B
l
l
l
Approx. Weight: 0.008 gram  
Mounting Position: Any  
Storage & Operating Junction Temperature: -55oC to +150oC  
C
E
Maximum Ratings @ 25oC Unless Otherwise Specified  
Forward Current  
Maximum Forward  
Voltage  
IF  
VF  
100  
1.2  
mA  
V
F
D
Power Dissipation  
(Notes A)  
Peak Forward Surge  
Current (Notes B)  
P(AV)  
200  
2.0  
mWatt  
Amps  
G
IFSM  
NOTES:  
DIMENSIONS  
MM  
A. Mountedon5.0mm2(.013mmthick)landareas.  
B. Measured on 8.3ms, single half sine-wave or equivalent  
squarewave, dutycycle=4pulsesperminutemaximum.  
DIM  
INCHES  
MIN  
NOTE  
MAX  
.107  
.078  
.054  
.038  
.014  
.006  
---  
MIN  
2.30  
1.75  
1.15  
0.70  
0.25  
0.05  
0.30  
MA X  
2.70  
1.95  
1.35  
0.95  
0.35  
0.15  
---  
A
B
C
D
E
F
.090  
.068  
.045  
.027  
.009  
.002  
.012  
G
SUGGESTED SOLDER  
PAD LAYOUT  
0.059"  
0.039”  
0.031”  
www.mccsemi.com  
Revision: 4  
2006/05/13  
1 of 5  

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