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MMSZ5250CT1G PDF预览

MMSZ5250CT1G

更新时间： 2024-11-28 12:04:19
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器二极管齐纳二极管测试光电二极管PC
页数 文件大小 规格书
7页 130K
描述
Zener Voltage Regulators 500 mW SOD−123 Surface Mount

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中文翻译

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MMSZ5250CT1G 技术参数

是否无铅：不含铅生命周期：Active
包装说明：R-PDSO-G2针数：2
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50Factory Lead Time：8 weeks
风险等级：0.58Samacsys Confidence：4
Samacsys Status：ReleasedSamacsys PartID：729053
Samacsys Pin Count：2Samacsys Part Category：Zener Diode
Samacsys Package Category：Small Outline DiodeSamacsys Footprint Name：SOD-123 CASE425-04 ISSUE G
Samacsys Released Date：2017-05-07 09:44:12Is Samacsys：N
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODE最大动态阻抗：25 Ω
JESD-30 代码：R-PDSO-G2JESD-609代码：e3
湿度敏感等级：1元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
最大功率耗散：0.5 W标称参考电压：20 V
子类别：Voltage Reference Diodes表面贴装：YES
技术：ZENER端子面层：Tin (Sn)
端子形式：GULL WING端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED最大电压容差：2%
工作测试电流：6.2 mABase Number Matches：1

MMSZ5250CT1G 数据手册

 浏览型号MMSZ5250CT1G的Datasheet PDF文件第2页浏览型号MMSZ5250CT1G的Datasheet PDF文件第3页浏览型号MMSZ5250CT1G的Datasheet PDF文件第4页浏览型号MMSZ5250CT1G的Datasheet PDF文件第5页浏览型号MMSZ5250CT1G的Datasheet PDF文件第6页浏览型号MMSZ5250CT1G的Datasheet PDF文件第7页 
MMSZ52xxxT1G Series,  
SZMMSZ52xxxT1G Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
• 500 mW Rating on FR−4 or FR−5 Board  
• Wide Zener Reverse Voltage Range − 2.4 V to 110 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• General Purpose, Medium Current  
SOD−123  
CASE 425  
STYLE 1  
• ESD Rating of Class 3 (> 16 kV) per Human Body Model  
1
2
Cathode  
Anode  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
MARKING DIAGRAM  
• These are Pb−Free Devices*  
xx MG  
Mechanical Characteristics:  
1
G
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xx = Device Code (Refer to page 3)  
M
G
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
MAXIMUM RATINGS  
†
Rating  
Symbol  
Max  
Units  
Device  
Package  
Shipping  
Total Power Dissipation on FR−5 Board,  
P
MMSZ52xxBT1G,  
SZMMSZ52xxBT1G  
SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
D
(Note 1) @ T = 75°C  
500  
6.7  
mW  
L
Derated above 75°C  
mW/°C  
MMSZ52xxCT1G,  
SZMMSZ52xxCT1G  
SOD−123  
(Pb−Free)  
3,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
340  
°C/W  
°C/W  
°C  
q
JA  
MMSZ52xxBT3G,  
SZMMSZ52xxBT3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Lead  
(Note 2)  
R
q
JL  
150  
MMSZ52xxCT3G,  
SZMMSZ52xxCT3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 − Rev. 12  
MMSZ5221BT1/D  
 
1234567

中文翻译

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