Datasheet > MMSZ5237CS

MMSZ5237CS

更新时间： 2024-09-15 14:52:43

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MMSZ5237CS 数据手册

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD

SOD-323 Plastic-Encapsulate Diodes

SOD-323

MMSZ5221CS-MMSZ5259CS ^{ZENER DIODE}

FEATURES

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Maximum Ratings (Ta=25℃ unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Symbol

V_F

Value

0.9

Unit

@ I_F= 10mA

P_d

200

Thermal Resistance, Junction to Ambient Air

R_θJA

625

℃/W

℃

T_J,Tstg

Operation Junction and Storage Temperature Range

-55~+150

Notes: 1. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm².

2. Tested with pulses, Tp≤1.0ms.

www.jscj-elec.com

Rev. - 2.1

12 3 4 5

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