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MMSZ4711/D3 PDF预览

MMSZ4711/D3

更新时间: 2024-11-28 14:30:27
品牌 Logo 应用领域
威世 - VISHAY 测试光电二极管
页数 文件大小 规格书
2页 51K
描述
Zener Diode, 27V V(Z), 5%, 0.5W, Silicon, Unidirectional

MMSZ4711/D3 技术参数

是否无铅: 不含铅是否Rohs认证: 不符合
生命周期:Transferred包装说明:R-PDSO-G2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.12配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JESD-30 代码:R-PDSO-G2JESD-609代码:e0
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性:UNIDIRECTIONAL最大功率耗散:0.5 W
认证状态:Not Qualified标称参考电压:27 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
最大电压容差:5%工作测试电流:0.05 mA
Base Number Matches:1

MMSZ4711/D3 数据手册

 浏览型号MMSZ4711/D3的Datasheet PDF文件第2页 
MMSZ4681 thru MMSZ4717  
Zener Diodes  
V Range 2.4 to 43V  
Z
Power Dissipation 500mW  
SOD-123  
.022 (0.55)  
Mounting Pad Layout  
Cathode Band  
0.055 (1.40)  
0.094 (2.40)  
Top View  
)
5)  
)
5)  
(
140(3.  
2
10(2.  
.
.
.
.
Dimensions in inches  
and (millimeters)  
53)  
.
x
.067 (1.70)  
.055 (1.40)  
am  
51)  
.
x
503(1.  
.
amx.  
am  
6(0.  
4(0.1)  
.
.010 (0.25)  
min.  
Features  
Mechanical Data  
Silicon Planar Zener Diodes.  
Case: SOD-123 Plastic Case  
Weight: approx. 0.01 grams  
Packaging codes/options:  
Standard Zener voltage tolerance is ±5%. Other  
tolerances are available upon request.  
High temperature soldering guaranteed:  
250˚C/10 seconds set terminals.  
D3/10K per 13reel (8mm tape), 30K/box  
D4/3K per 7reel (8mm tape), 30K/box  
These diodes are also available in DO-35 case  
with the type designation 1N4681...1N4717 and  
SOT-23 case with the type designation  
MMBZ4681... MMBZ4717.  
Maximum Ratings and Thermal Characteristics (TA = 25°C unless otherwise noted)  
Parameter  
Symbol  
Value  
Unit  
Zener Current (see Table Characteristics)  
Power Dissipation at TL = 75°C  
Thermal Resistance Junction to Ambient Air  
Maximum Junction Temperature  
Storage Temperature Range  
Ptot  
RΘJA  
Tj  
500(1)  
340(1)  
mW  
°C/W  
°C  
150  
TS  
55 to +150  
°C  
Notes:  
(1) On FR-4 or FR-5 board with minimum recommended solder pad layout.  
8/1/00  

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