MMSZ4xxxT1G Series,
SZMMSZ4xxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
SOD−123
CASE 425
STYLE 1
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
1
2
Cathode
Anode
• These Devices are Pb−Free and are RoHS Compliant*
MARKING DIAGRAM
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
xx M G
1
G
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
xx = Device Code (Refer to page 3)
M
= Date Code
G
= Pb−Free Package
MAXIMUM RATINGS
(Note: Microdot may be in either location)
Rating
Symbol
Max
Units
Total Power Dissipation on FR−5 Board,
P
D
ORDERING INFORMATION
(Note 1) @ T = 75°C
500
6.7
mW
mW/°C
L
†
Derated above 75°C
Device
Package
Shipping
MMSZ4xxxT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance, (Note 2)
R
°C/W
°C/W
°C
q
JA
Junction−to−Ambient
340
150
SZMMSZ4xxxT1G SOD−123
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance, (Note 2)
Junction−to−Lead
R
q
JL
MMSZ4xxxT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
Junction and Storage Temperature Range
T , T
J
−55 to
+150
stg
SZMMSZ4xxxT3G SOD−123
(Pb−Free)
10,000 /
Tape & Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
November, 2013 − Rev. 10
MMSZ4678T1/D