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MMSZ4709T3G PDF预览

MMSZ4709T3G

更新时间: 2024-09-15 15:43:47
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安森美 - ONSEMI /
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MMSZ4709T3G 数据手册

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MMSZ4xxxT1G Series,  
SZMMSZ4xxxT1G Series  
Zener Voltage Regulators  
500 mW SOD123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD123 package. These devices provide a  
convenient alternative to the leadless 34package style.  
http://onsemi.com  
Features  
500 mW Rating on FR4 or FR5 Board  
Wide Zener Reverse Voltage Range 1.8 V to 43 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
SOD123  
CASE 425  
STYLE 1  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
1
2
Cathode  
Anode  
These Devices are PbFree and are RoHS Compliant*  
MARKING DIAGRAM  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
xx M G  
1
G
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V0  
xx = Device Code (Refer to page 3)  
M
= Date Code  
G
= PbFree Package  
MAXIMUM RATINGS  
(Note: Microdot may be in either location)  
Rating  
Symbol  
Max  
Units  
Total Power Dissipation on FR5 Board,  
P
D
ORDERING INFORMATION  
(Note 1) @ T = 75°C  
500  
6.7  
mW  
mW/°C  
L
Derated above 75°C  
Device  
Package  
Shipping  
MMSZ4xxxT1G  
SOD123  
(PbFree)  
3,000 /  
Tape & Reel  
Thermal Resistance, (Note 2)  
R
°C/W  
°C/W  
°C  
q
JA  
JunctiontoAmbient  
340  
150  
SZMMSZ4xxxT1G SOD123  
(PbFree)  
3,000 /  
Tape & Reel  
Thermal Resistance, (Note 2)  
JunctiontoLead  
R
q
JL  
MMSZ4xxxT3G  
SOD123  
(PbFree)  
10,000 /  
Tape & Reel  
Junction and Storage Temperature Range  
T , T  
J
55 to  
+150  
stg  
SZMMSZ4xxxT3G SOD123  
(PbFree)  
10,000 /  
Tape & Reel  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
November, 2013 Rev. 10  
MMSZ4678T1/D  
 

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