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MMSZ4706T1G PDF预览

MMSZ4706T1G

更新时间: 2024-11-05 04:58:51
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
6页 75K
描述
Zener Voltage Regulators 500 mW SOD−123 Surface Mount

MMSZ4706T1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:R-PDSO-G2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50Factory Lead Time:1 week
风险等级:0.54配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JESD-30 代码:R-PDSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.5 W认证状态:Not Qualified
标称参考电压:19 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
最大电压容差:5%工作测试电流:0.05 mA
Base Number Matches:1

MMSZ4706T1G 数据手册

 浏览型号MMSZ4706T1G的Datasheet PDF文件第2页浏览型号MMSZ4706T1G的Datasheet PDF文件第3页浏览型号MMSZ4706T1G的Datasheet PDF文件第4页浏览型号MMSZ4706T1G的Datasheet PDF文件第5页浏览型号MMSZ4706T1G的Datasheet PDF文件第6页 
MMSZ4678T1 Series  
Preferred Device  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Features  
500 mW Rating on FR−4 or FR−5 Board  
Wide Zener Reverse Voltage Range − 1.8 V to 43 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Pb−Free Packages are Available  
1
2
Cathode  
Anode  
SOD−123  
CASE 425  
STYLE 1  
2
Mechanical Characteristics:  
1
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
MARKING DIAGRAM  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
xx M G  
1
G
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
xx = Device Code (Refer to page 3)  
M
= Date Code  
Total Power Dissipation on FR−5 Board,  
P
D
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
500  
6.7  
mW  
mW/°C  
(Note 1) @ T = 75°C  
Derated above 75°C  
L
Thermal Resistance, (Note 2)  
Junction−to−Ambient  
R
340  
150  
°C/W  
°C/W  
°C  
q
JA  
ORDERING INFORMATION  
Thermal Resistance, (Note 2)  
Junction−to−Lead  
R
Device  
Package  
Shipping  
q
JL  
MMSZ4xxxT1  
SOD−123  
3000/Tape & Reel  
3000/Tape & Reel  
Junction and Storage Temperature Range  
T , T  
J
−55 to  
+150  
stg  
MMSZ4xxxT1G  
SOD−123  
(Pb−Free)  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
MMSZ4xxxT3  
SOD−123 10000/Tape & Reel  
MMSZ4xxxT3G  
SOD−123 10000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of this  
data sheet.  
Devices listed in bold, italic are ON Semiconductor  
Preferred devices. Preferred devices are recommended  
choices for future use and best overall value.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 7  
MMSZ4678T1/D  
 

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SZMMSZ5249BT1G ONSEMI

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