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MMSZ4685T1G-T PDF预览

MMSZ4685T1G-T

更新时间: 2024-11-28 13:51:35
品牌 Logo 应用领域
RECTRON /
页数 文件大小 规格书
5页 281K
描述
Zener Diode,

MMSZ4685T1G-T 技术参数

是否Rohs认证:符合生命周期:Obsolete
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.84
Is Samacsys:NJESD-609代码:e3
端子面层:Matte Tin (Sn)Base Number Matches:1

MMSZ4685T1G-T 数据手册

 浏览型号MMSZ4685T1G-T的Datasheet PDF文件第2页浏览型号MMSZ4685T1G-T的Datasheet PDF文件第3页浏览型号MMSZ4685T1G-T的Datasheet PDF文件第4页浏览型号MMSZ4685T1G-T的Datasheet PDF文件第5页 
MMSZ4687T1-  
MMSZ4717T1  
SURFACE MOUNT ZENER DIODE  
VOLTAGE RANGE 1.8 to 43 Volts POWER RATING 500 mWatts  
FEATURES  
* Wide Zener Reverse Voltage Range : 1.8V to 43V  
500mW Rating on FR-4 or FR-5 Board  
*
Small Package Size for High Density Applications  
Ldeally Suited for Automated Assembly Processes  
ESD Rating of Class 3 (>16kV) per Human Body Model  
*
*
*
SOD-123  
MECHANICAL DATA  
* Case: Molded plastic  
.110(2.80)  
.102(2.60)  
* Epoxy: UL 94V-O rate flame retardant  
* Lead: MIL-STD-202E method 208C guaranteed  
* Mounting position: Any  
.067(1.70)  
.059(1.50)  
* Weight: 0.01 gram  
.152(3.85)  
.140(3.55)  
.049(1.25)  
.041(1.05)  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25 oC ambient temperature unless otherwise specified.  
.004(0.10)  
.000(0.00)  
REF .020(0.50)  
Dimensions in inches and (millimeters)  
MAXIMUM RATINGES ( @ TA = 25oC unless otherwise noted )  
RATINGS  
SYMBOL  
PD  
VALUE  
UNITS  
o
Max. Power Dissipation on FR-5 Board,@TL=75 C (Note 1)  
500  
6.7  
mW  
O
Derated above 75 C  
mW/oC  
oC  
oC  
150  
Max. Operating Temperature Range  
Storage Temperature Range  
TJ  
-65 to +150  
TSTG  
ELECTRICAL CHARACTERISTICS ( @ TA = 25oC unless otherwise noted )  
CHARACTERISTICS  
SYMBOL  
MIN.  
TYP.  
MAX.  
340  
UNITS  
oC/W  
oC/W  
Volts  
Thermal Resistance Junction to Ambient (Note 2)  
Thermal Resistance Junction to Lead (Note 2)  
Max. Instantaneous Forward Voltage at IF= 10mA  
R
-
-
-
-
-
-
θJA  
R
150  
θJL  
VF  
0.95  
2007-3  
Note 1. FR-5 = 3.5 X 1.5 inches, using the minimum recommended footprint.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  

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