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MMSZ2V4ET1G

更新时间: 2024-09-14 03:21:15
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
7页 82K
描述
Zener Voltage Regulators 500 mW SOD−123 Surface Mount

MMSZ2V4ET1G 数据手册

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MMSZ2V4ET1 Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Specification Features  
500 mW Rating on FR−4 or FR−5 Board  
1
2
Wide Zener Reverse Voltage Range − 2.4 V to 56 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Peak Power − 225 W (8 X 20 ms)  
Cathode  
Anode  
2
Pb−Free Packages are Available  
1
Mechanical Characteristics  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
SOD−123  
CASE 425  
STYLE 1  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
MARKING DIAGRAM  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
xxx M G  
G
Peak Power Dissipation @ 20 ms (Note 1)  
P
225  
W
pk  
@ T 25°C  
L
Total Power Dissipation on FR−5 Board,  
P
D
(Note 2) @ T = 75°C  
500  
6.7  
mW  
mW/°C  
L
xxx = Device Code  
Derated above 75°C  
M
= Date Code  
G
= Pb−Free Package  
Thermal Resistance, Junction−to−Ambient  
(Note 3)  
R
340  
°C/W  
°C/W  
°C  
q
JA  
(Note: Microdot may be in either location)  
Thermal Resistance, Junction−to−Lead  
(Note 3)  
R
q
JL  
150  
ORDERING INFORMATION  
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
Device  
Package  
Shipping  
3000/Tape & Reel  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. Nonrepetitive current pulse per Figure 11  
2. FR−5 = 3.5 X 1.5 inches, using the ON minimum recommended footprint  
3. Thermal Resistance measurement obtained via infrared Scan Method  
MMSZxxxET1  
SOD−123  
(Pb−Free)  
MMSZxxxET3  
SOD−123 10,000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 5  
MMSZ2V4ET1/D  
 

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