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MMBZ5228C-HE3-18 PDF预览

MMBZ5228C-HE3-18

更新时间: 2024-12-01 22:52:27
品牌 Logo 应用领域
威世 - VISHAY 测试光电二极管
页数 文件大小 规格书
4页 96K
描述
DIODE ZENER 3.9V 225MW SOT23-3

MMBZ5228C-HE3-18 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
Factory Lead Time:12 weeks风险等级:5.22
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:23 Ω
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.225 W参考标准:AEC-Q101
标称参考电压:3.9 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:10
最大电压容差:2%工作测试电流:20 mA
Base Number Matches:1

MMBZ5228C-HE3-18 数据手册

 浏览型号MMBZ5228C-HE3-18的Datasheet PDF文件第2页浏览型号MMBZ5228C-HE3-18的Datasheet PDF文件第3页浏览型号MMBZ5228C-HE3-18的Datasheet PDF文件第4页 
MMBZ5225 to MMBZ5267  
www.vishay.com  
Vishay Semiconductors  
Small Signal Zener Diodes  
FEATURES  
Available  
• Silicon planar power Zener diodes  
3
• Standard Zener voltage tolerance is  
5 %  
with a “B” suffix (e.g.: MMBZ5225B), suffix  
“C” is 2 % tolerance.  
• High temperature soldering guaranteed:  
260 °C/4 x 10 s at terminals  
1
2
• AEC-Q101 qualified available  
• ESD capability according to AEC-Q101:  
Human body model > 8 kV  
Machine model > 800 V  
click logo to get started  
DESIGN SUPPORT TOOLS  
• Base P/N-E3 - RoHS-compliant, commercial grade  
• Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified  
Models  
Available  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
PRIMARY CHARACTERISTICS  
PARAMETER  
VALUE  
UNIT  
V
VZ range nom.  
3 to 75  
Test current IZT  
VZ specification  
Circuit configuration  
1.7 to 20  
mA  
Thermal equilibrium  
Single  
ORDERING INFORMATION  
DEVICE NAME  
ORDERING CODE  
TAPED UNITS PER REEL  
MINIMUM ORDER QUANTITY  
MMBZ5225B-E3-08 to MMBZ5267B-E3-08  
MMBZ5225C-E3-08 to MMBZ5267C-E3-08  
MMBZ5225B-HE3-08 to MMBZ5267B-HE3-08  
MMBZ5225C-HE3-08 to MMBZ5267C-HE3-08  
MMBZ5225B-E3-18 to MMBZ5267B-E3-18  
MMBZ5225C-E3-18 to MMBZ5267C-E3-18  
MMBZ5225B-HE3-18 to MMBZ5267B-HE3-18  
MMBZ5225C-HE3-18 to MMBZ5267C-HE3-18  
3000 (8 mm tape on 7" reel)  
15 000/box  
MMBZ5225 to  
MMBZ5267  
10 000 (8 mm tape on 13" reel)  
10 000/box  
PACKAGE  
MOLDING COMPOUND  
WEIGHT  
MOISTURE SENSITIVITY  
LEVEL  
PACKAGE NAME  
SOLDERING CONDITIONS  
FLAMMABILITY RATING  
MSL level 1  
(according J-STD-020)  
SOT-23  
8.8 mg  
UL 94 V-0  
260 °C/10 s at terminals  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
Power dissipation  
Zener current  
TEST CONDITION  
On FR - 5 board using recommended solder pad layout  
On alumina substrate  
SYMBOL  
VALUE  
225  
UNIT  
mW  
Ptot  
Ptot  
300  
mW  
See table “Electrical Characteristics”  
Thermal resistance,  
junction to ambient air  
On FR - 5 board using recommended solder pad layout  
RthJA  
556  
K/W  
Tj  
Junction temperature  
150  
°C  
°C  
°C  
Tstg  
Top  
Storage temperature range  
Operating temperature range  
-65 to +150  
-55 to +150  
Rev. 1.9, 13-Feb-18  
Document Number: 85772  
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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