MMBD452LT1
Preferred Device
Dual Hot−Carrier Diodes
Schottky Barrier Diodes
These devices are designed primarily for high−efficiency UHF and
VHF detector applications. They are readily adaptable to many other
fast switching RF and digital applications. They are supplied in an
inexpensive plastic package for low−cost, high−volume consumer
and industrial/commercial requirements.
http://onsemi.com
30 VOLTS
DUAL HOT−CARRIER
DETECTOR AND SWITCHING
DIODES
Features
• Extremely Low Minority Carrier Lifetime
• Very Low Capacitance
• Low Reverse Leakage
• Pb−Free Package is Available
1
2
ANODE
CATHODE
MAXIMUM RATINGS (T = 125°C unless otherwise noted)
J
3
Rating
Symbol
Value
Unit
CATHODE/ANODE
Reverse Voltage
V
R
30
V
Forward Power Dissipation
P
F
3
@ T = 25°C
225
1.8
mW
mW/°C
A
SOT−23 (TO−236)
CASE 318
Derate above 25°C
1
STYLE 11
Operating Junction Temperature Range
Storage Temperature Range
T
J
−55 to +125
−55 to +150
°C
°C
2
T
stg
Maximum ratings are those values beyond which device damage can occur.
Maximumratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may
be affected.
MARKING DIAGRAM
5N M G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
(EACH DIODE)
A
G
1
Characteristic
Symbol Min Typ Max
Unit
Reverse Breakdown Voltage
V
(BR)R
30
−
−
V
(I = 10 mA)
R
5N = Device Code
M
G
= Date Code*
= Pb−Free Package
Total Capacitance
C
−
0.9
13
1.5
200
pF
nAdc
Vdc
Vdc
T
(V = 15 V, f = 1.0 MHz) Figure 1
R
(Note: Microdot may be in either location)
Reverse Leakage
I
R
−
*Date Code orientation and/or overbar may vary
dependingupon manufacturing location.
(V = 25 V) Figure 3
R
Forward Voltage
V
F
V
F
−
0.38 0.45
0.52 0.6
(I = 1.0 mAdc) Figure 4
F
ORDERING INFORMATION
Forward Voltage
−
†
Device
Package
Shipping
(I = 10 mAdc) Figure 4
F
MMBD452LT1
SOT−23 3,000 / Tape & Reel
MMBD452LT1G
SOT−23 3,000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 3
MMBD452LT1/D