SPICE MODEL: MMBD4448HW
MMBD4448HW
SURFACE MOUNT SWITCHING DIODE
Lead-free Green
Features
·
·
·
·
·
·
Fast Switching Speed
Surface Mount Package Ideally Suited for Automatic Insertion
A
SOT-323
Dim
A
B
C
D
E
Min
0.25
1.15
2.00
Max
0.40
1.35
2.20
For General Purpose Switching Applications
High Conductance
C
B
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
G
H
0.65 Nominal
Mechanical Data
0.30
1.20
1.80
0.0
0.40
1.40
2.20
0.10
1.00
0.40
0.18
8°
·
Case: SOT-323
K
M
G
H
J
·
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
J
L
D
F
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
K
L
0.90
0.25
0.10
0°
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
M
a
·
·
·
Polarity: See Diagram
All Dimensions in mm
Marking: KA1 (See Page 2)
Weight: 0.006 grams (approximate)
TOP VIEW
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRM
Non-Repetitive Peak Reverse Voltage
100
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
80
VR(RMS)
IFM
RMS Reverse Voltage
57
V
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
500
250
mA
mA
IO
Non-Repetitive Peak Forward Surge Current @ t = 1.0ms
4.0
2.0
IFSM
Pd
A
@ t = 1.0s
Power Dissipation (Note 1)
200
625
mW
°C/W
°C
R
qJA
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Tj , TSTG
-65 to +150
@ TA = 25°C unless otherwise specified
Electrical Characteristics
Characteristic
Symbol
Min
Max
¾
Unit
Test Condition
V(BR)R
Reverse Breakdown Voltage (Note 2)
IR = 2.5mA
80
V
IF = 5.0mA
IF = 10mA
IF = 100mA
IF = 150mA
0.62
¾
0.72
0.855
1.0
VF
Forward Voltage
V
¾
¾
1.25
VR = 70V
100
50
nA
mA
mA
nA
VR = 75V, Tj = 150°C
VR = 25V, Tj = 150°C
VR = 20V
IR
Peak Reverse Current (Note 2)
¾
30
25
VR = 6V, f = 1.0MHz
VR = 6V, IF = 5mA
CT
trr
Total Capacitance
¾
¾
3.5
4.0
pF
ns
Reverse Recovery Time
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30228 Rev. 5 - 2
1 of 3
MMBD4448HW
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