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MM5Z18VT5G PDF预览

MM5Z18VT5G

更新时间： 2023-06-19 14:32:54
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管齐纳二极管稳压器
页数 文件大小 规格书
4页 102K
描述
500 mW 标准容差齐纳二极管稳压器

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中文翻译

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MM5Z18VT5G 技术参数

是否无铅： 不含铅生命周期：Active
包装说明：SOD-523, 2 PINReach Compliance Code：compliant
Factory Lead Time：6 weeks风险等级：5.58
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODE最大动态阻抗：45 Ω
最大正向电压 (VF)：0.9 VJESD-30 代码：R-PDSO-F2
JESD-609代码：e3膝阻抗最大值：80 Ω
湿度敏感等级：1元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-65 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
极性：UNIDIRECTIONAL最大功率耗散：0.5 W
标称参考电压：18 V最大反向电流：0.05 µA
反向测试电压：12.6 V表面贴装：YES
技术：ZENER端子面层：Matte Tin (Sn)
端子形式：FLAT端子位置：DUAL
最大电压容差：6.41%工作测试电流：5 mA

MM5Z18VT5G 数据手册

 浏览型号MM5Z18VT5G的Datasheet PDF文件第2页浏览型号MM5Z18VT5G的Datasheet PDF文件第3页浏览型号MM5Z18VT5G的Datasheet PDF文件第4页 
MM5ZxxxT1G Series,  
SZMM5ZxxxT1G Series  
Zener Voltage Regulators  
300 mW SOD−523 Surface Mount  
This series of Zener diodes is packaged in a SOD−523 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
http://onsemi.com  
SOD−523  
CASE 502  
STYLE 1  
Specification Features:  
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V  
• Steady State Power Rating of 300 mW  
• Small Body Outline Dimensions:  
0.047″ x 0.032″ (1.20 mm x 0.80 mm)  
1
2
• Low Body Height: 0.028″ (0.7 mm)  
• ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Cathode  
Anode  
• AEC−Q101 Qualified and PPAP Capable − SZMM5ZxxxT1G  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
• These are Pb−Free Devices*  
MARKING DIAGRAM  
XX M G  
G
2
1
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
XX = Specific Device Code  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
MAXIMUM RATINGS  
†
Device  
Package  
Shipping  
Rating  
Symbol  
Max  
Unit  
MM5ZxxxxT1G  
SOD−523  
(Pb−Free)  
3,000 /  
Tape & Reel  
Total Device Dissipation FR−5 Board,  
P
D
300  
mW  
@ T = 25°C  
A
SZMM5ZxxxT1G SOD−523  
(Pb−Free)  
3,000 /  
Tape & Reel  
Thermal Resistance,  
R
390  
°C/W  
°C  
q
JA  
Junction−to−Ambient (Note 1)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage  
Temperature Range  
T , T  
J
−65 to +150  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 3 of this data sheet.  
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method  
2
(25 mm , 2 oz., 3.8 mm plating).  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
April, 2013 − Rev. 10  
MM5Z2V4T1/D  
 
1234

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