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MM3Z9V1T3G PDF预览

MM3Z9V1T3G

更新时间: 2024-11-25 11:01:39
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
6页 64K
描述
200mW 5% Zener, SOD323

MM3Z9V1T3G 技术参数

是否无铅: 不含铅生命周期:End Of Life
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.69二极管类型:ZENER DIODE
JESD-609代码:e3湿度敏感等级:1
端子面层:Tin (Sn)Base Number Matches:1

MM3Z9V1T3G 数据手册

 浏览型号MM3Z9V1T3G的Datasheet PDF文件第2页浏览型号MM3Z9V1T3G的Datasheet PDF文件第3页浏览型号MM3Z9V1T3G的Datasheet PDF文件第4页浏览型号MM3Z9V1T3G的Datasheet PDF文件第5页浏览型号MM3Z9V1T3G的Datasheet PDF文件第6页 
MM3Z2V4T1 SERIES  
Zener Voltage Regulators  
200 mW SOD−323 Surface Mount  
This series of Zener diodes is packaged in a SOD−323 surface  
mount package that has a power dissipation of 200 mW. They are  
designed to provide voltage regulation protection and are especially  
attractive in situations where space is at a premium. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
1
2
Specification Features:  
Cathode  
Anode  
Standard Zener Breakdown Voltage Range − 2.4 V to 75 V  
Steady State Power Rating of 200 mW  
Small Body Outline Dimensions:  
0.067x 0.049(1.7 mm x 1.25 mm)  
Low Body Height: 0.035(0.9 mm)  
MARKING  
DIAGRAM  
Package Weight: 4.507 mg/unit  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Pb−Free Package is Available  
xx M  
SOD−323  
CASE 477  
Mechanical Characteristics:  
xx = Specific Device Code  
M = Date Code  
CASE: Void-free, transfer-molded plastic  
FINISH: All external surfaces are corrosion resistant  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
ORDERING INFORMATION  
LEADS: Plated with Pb−Sn or Sn only (Pb−Free)  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
MOUNTING POSITION: Any  
{
Device  
Package  
Shipping  
MM3ZxxxT1  
MM3ZxxxT1G  
SOD−323  
3000/Tape & Reel  
3000/Tape & Reel  
SOD−323  
(Pb−Free)  
MAXIMUM RATINGS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Rating  
Symbol  
Max  
Unit  
Total Device Dissipation FR−5 Board,  
P
D
(Note 1) @ T = 25°C  
Derate above 25°C  
200  
1.5  
mW  
mW/°C  
A
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
Thermal Resistance from  
Junction to Ambient  
R
635  
°C/W  
°C  
q
JA  
Junction and Storage  
Temperature Range  
T , T  
J
−65 to  
+150  
stg  
1. FR−4 Minimum Pad  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
April, 2004 − Rev. 6  
MM3Z2V4T1/D  
 

MM3Z9V1T3G 替代型号

型号 品牌 替代类型 描述 数据表
MM3Z9V1T1G ONSEMI

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