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MLL5545CUR-1E3TR PDF预览

MLL5545CUR-1E3TR

更新时间: 2024-11-15 16:35:59
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美高森美 - MICROSEMI /
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MLL5545CUR-1E3TR 数据手册

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IN5518BUR-1 thru 1N5546BUR-1  
(or MLL5518B-1 thru MLL5546B-1)  
Low Voltage Surface Mount  
500 mW Avalanche Diodes  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface  
mount Zener voltage regulators provides a selection from 3.3 to 33 volts in  
standard 5% tolerances as well as tighter tolerances identified by different  
suffix letters on the part number. These have an internal-metallurgical-bond  
option as identified by the “–1” suffix. This internally bonded Zener package  
construction is also in JAN, JANTX, and JANTXV military qualifications.  
Microsemi also offers numerous other Zener products to meet higher and  
lower power applications.  
DO-213AA  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalent to JEDEC registered  
1N5518 thru 1N5546 series  
Regulates voltage over a broad operating current  
and temperature range  
Internal metallurgical bond with the “-1” suffix  
Extensive selection from 3.3 to 33 V  
Also available in JAN, JANTX, and JANTXV  
qualifications per MIL-PRF-19500/437 by adding  
the JAN, JANTX, or JANTXV prefixes to part  
numbers for desired level of screening; (e.g.  
JANTX1N4099UR-1, JANTXV1N4109CUR-1, etc.)  
Standard voltage tolerances are plus/minus 5% with  
a “B” suffix, e.g. 1N5518BUR-1, etc.  
Tight tolerances available in plus or minus 2% or 1%  
with C or D suffix respectively, e.g. 1N5518CUR-1,  
1N5518DUR-1, etc.  
Nonbonded types also available without the “-1”  
suffix for both the axial and surface mount  
packages  
Hermetically sealed surface mount package  
Nonsensitive to ESD per MIL-STD-750 Method 1020  
Minimal capacitance (see Figure 3)  
DO-7 or DO-35 glass body axial-leaded Zener  
equivalents also available per JEDEC registration  
with part numbers 1N5518 thru 1N5546 on  
separate data sheets  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Operating and Storage temperature: -65ºC to  
CASE: Hermetically sealed glass DO-213AA  
(SOD80 or MLL34) MELF style package  
+175ºC  
Thermal Resistance: 100 ºC/W junction to end cap,  
or 250ºC/W junction to ambient when mounted on  
FR4 PC board (1 oz Cu) with recommended  
footprint (see last page)  
TERMINALS: End caps tin-lead plated solderable  
per MIL-STD-750, method 2026  
POLARITY: Cathode indicated by band where  
diode is to be operated with the banded end positive  
with respect to the opposite end for Zener regulation  
Steady-State Power: 0.5 watts at end cap  
temperature TEC < 125oC or at ambient TA < 50ºC  
when mounted on FR4 PC board as described for  
thermal resistance above (see Figure 2 for  
derating)  
MARKING: cathode band only  
TAPE & REEL option: Standard per EIA-481-1-A  
with 12 mm tape, 2000 per 7 inch reel or 5000 per  
13 inch reel (add “TR” suffix to part number)  
Forward voltage @200 mA: 1.1 volts  
Solder Temperatures: 260 ºC for 10 s (max)  
WEIGHT: 0.04 grams  
See package dimensions on last page  
Copyright © 2003  
10-31-2003 REV B  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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