Datasheet > MLL4732CUR-1

MLL4732CUR-1

更新时间： 2024-11-27 05:02:47

品牌	Logo	应用领域
美高森美 - MICROSEMI		测试二极管
页数	文件大小	规格书
5页	154K
描述
Zener Diode, 4.7V V(Z), 2%, 1W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

MLL4732CUR-1 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	零件包装代码：	DO-213AB
包装说明：	O-LELF-R2	针数：	2
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.10.00.50	风险等级：	5.56
其他特性：	HIGH RELIABILITY	外壳连接：	ISOLATED
配置：	SINGLE	二极管元件材料：	SILICON
二极管类型：	ZENER DIODE	JEDEC-95代码：	DO-213AB
JESD-30 代码：	O-LELF-R2	JESD-609代码：	e0
湿度敏感等级：	1	元件数量：	1
端子数量：	2	封装主体材料：	GLASS
封装形状：	ROUND	封装形式：	LONG FORM
峰值回流温度（摄氏度）：	NOT SPECIFIED	极性：	UNIDIRECTIONAL
最大功率耗散：	1 W	认证状态：	Not Qualified
标称参考电压：	4.7 V	表面贴装：	YES
技术：	ZENER	端子面层：	TIN LEAD
端子形式：	WRAP AROUND	端子位置：	END
处于峰值回流温度下的最长时间：	NOT SPECIFIED	最大电压容差：	2%
工作测试电流：	53 mA	Base Number Matches：	1

MLL4732CUR-1 数据手册

1N4728UR-1 thru 1N4764AUR-1,e3

(or MLL4728A-1 thru MLL4764A-1,e3)

METALLURGICALLY BONDED GLASS

SURFACE MOUNT 1.0 W ZENERS

S C O T T S D A L E D I V I S I O N

DESCRIPTION

APPEARANCE

This surface mountable 1 watt Zener diode series is electrically equivalent to

the 1N4728A thru 1N4764A registration in the DO-41 equivalent package

except that it meets the JEDEC surface mount outline DO-213AB and also

includes enhanced internal contact design. It is an ideal selection for

applications of high density and low parasitic requirements for voltage

regulation. Standard voltage tolerance is +/-5% with tighter tolerances

available down to 1%. With its glass hermetic qualities, it may also be used

for high reliability applications when required by a source control drawing

(SCD).

DO-213AB

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

Electrically similar to the JEDEC registered 1N4728

thru 1N4764 zener series

•

Regulates voltage over a broad operating current

and temperature range

•

Zener voltages available 3.3V to 100V

Metallurgically enhanced internal contact design fro

greater reliability and lower thermal resistance

Standard voltage tolerances are +/- 5% with “A” suffix

and 10 % with no suffix identification

•

Wide selection from 3.3 to 100 V

Leadless package for surface mounting

Ideal for high density mounting

•

Tight tolerances available in plus or minus 2% or 1%

with C or D suffix respectively

Options for screening in accordance with MIL-PRF-

19500 for JAN, JANTX, JANTXV, and JANS are

available by adding MQ, MX, MV, or MSP prefixes

respectively to part numbers.

Nonsensitive to ESD

Hermetically sealed glass package

Specified capacitance (see Figure 2)

Inherently radiation hard per MicroNote 050

•

Surface mount equivalents also available as

SMAJ4728A to SMAJ4764A and SMAJ4728A to

SMAJ4764A

•

RoHS Compliant devices available by adding “e3” suffix

Plastic body axial-leaded Zener equivalents are also

available as 1N4728A to 1N4764A

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

Power dissipation at 25^ºC: 1.0 watts (also see derating

in Figure 1).

•

CASE: Hermetically sealed DO-213AB glass MELF

TERMINALS: Tin-Lead (Sn/Pb) or RohS Compliant

annealed matte-Tin plating solderable per MIL-STD-

750, method 2026

•

Operating and Storage temperature: -65^ºC to +175^ºC

Thermal Resistance: 40 ^ºC/W junction to end cap, or

120^ºC/W junction to ambient when mounted on FR4 PC

board (1 oz Cu) with recommended footprint (see last

page)

•

POLARITY: Cathode indicated by band. Diode to

be operated with the banded end positive with

respect to the opposite end for Zener regulation

•

Steady-State Power: 1.00 watts at T_EC< 135^oC, or

1.00 watts at T_A< 55^ºC when mounted on FR4 PC

board and recommended footprint as described for

thermal resistance (also see Figure 1)

•

MARKING: Cathode band only

TAPE & REEL optional: Standard per EIA-481-B

with 12 mm tape, 1500 per 7 inch reel or 5000 per

13 inch reel (add “TR” suffix to part number)

•

Forward voltage @200 mA: 1.2 volts (maximum)

Solder Temperatures: 260 ^ºC for 10 s (max)

•

WEIGHT: 0.05 grams

See package dimensions & recommended mounting

pad on last page

10-18-2005 REV A

Microsemi

Page 1

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

12 3 4 5

中文翻译

下载PDF

与MLL4732CUR-1相关器件

型号	品牌	获取价格	描述	数据表
MLL4732CUR-1E3	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 2%, 1W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETI
MLL4732CUR-1E3TR	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 2%, 1W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETI
MLL4732CURE3TR	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 2%, 1W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETI
MLL4732D	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS,
MLL4732D-1E3	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W
MLL4732D-1E3/TR	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W,
MLL4732D-1TR	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W
MLL4732D-1TRE3	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W
MLL4732DE3	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS,
MLL4732DTR	MICROSEMI	获取价格	Zener Diode, 4.7V V(Z), 1%, 1W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS,

与MLL4732CUR-1相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

45
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

34
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

62
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

59

产品中心

服务支持

精选活动

关于我们

帮助中心

MLL4732CUR-1

MLL4732CUR-1 技术参数

MLL4732CUR-1 数据手册

与MLL4732CUR-1相关器件

与MLL4732CUR-1相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MLL4732CUR-1

MLL4732CUR-1 技术参数

MLL4732CUR-1 数据手册

与MLL4732CUR-1相关器件

与MLL4732CUR-1相关文章

您还可以找

您在本页遇到什么问题？