Datasheet > MLK1005S15NJ

MLK1005S15NJ

更新时间： 2024-11-25 05:13:59

品牌	Logo	应用领域
东电化 - TDK		测试射频感应器电感器
页数	文件大小	规格书
7页	244K
描述
General Purpose Inductor, 0.015uH, 5%, 1 Element, Ceramic-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT

阅读下载

中文翻译

获取价格

数据手册
替代型号

如果您发现信息不准确，欢迎纠错

MLK1005S15NJ 数据手册

Conforming to RoHS Directive

Multilayer Chip Inductors

For High-frequency Circuits

And Modules,

Conformity to RoHS Directive: This means that, in conformity with

EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent

chromium, and specific bromine-based flame retardants, PBB

and PBDE, have not been used, except for exempted applications.

MLK0603 series

The 0603 type - the smallest in the industry, and the most advanced in the

MLK series, with numerous achievements in its use as a high Q element

optimal for signal-processing circuits in the 1-2GHz band in mobile commu-

nication devices such as RF amplifiers, mixers, VCO, PLL synthesizers - is

available in 19 varieties covering 1-33nH, responding to the cutting-edge

design needs of small digital devices.

With further fine-tuned super-fine lamination

technology, allowing no misalignment - even

of micron-order, mass-production technology

of condensed "Gigaspira^TMMultilayer struc-

ture", of greater precision than ever, inside

the super-small 0603 chip where the area of

internal conductor pattern can be reduced

to1/3 of the1005 type, has been established.

Shapes and dimensions

Recommende PC board pattern

(Reflow process)

0.6 0.03

A: 0.25 to 0.35

B : 0.2 to 0.3

0.15 0.05

0.65 to 0.95

C: 0.25 to 0.35

Dimensions in mm

Weight:0.2 mg

Dimensions in mm

0.2 min.

Gigaspira^TMmultilayer structure

Original GHz-band-ready structure

overcoming the limitations of the

conventional structures.

Recommended soldering conditions

Lead-free solder/High-temperature reflow process

240 to 250°C

230°C

Slow cooling

Cutting-edge hyper specifications and out-

standing circuit condensation effects are

offered too - not to mention diverse modules

for mobile telephones of the next generation;

small device RF modules such as DVC, digital

still cameras, and PDA devices; and CCD

modules, as well as downsizing the design of

Bluetooth modules integrated in those devices.

180°C

30 s max.

150°C

Preheating : 60 to 120 s

TDK CORPORATION

MLK0603

12 3 4 5 6 7

中文翻译

下载PDF

MLK1005S15NJ 替代型号

型号	品牌	替代类型	描述	数据表
L-07C15NJV6T	JOHANSON	功能相似	General Purpose Inductor, 0.015uH, 5%, 1 Element, Ceramic-Core, SMD, 0402, CHIP, 0402, ROH

与MLK1005S15NJ相关器件

型号	品牌	获取价格	描述	数据表
MLK1005S15NJT	TDK	获取价格	SMD Inductors For High Frequency
MLK1005S15NJT000	TDK	获取价格	General Purpose Inductor, 0.015uH, 5%, 1 Element, Ferrite-Core, SMD, 1005, CHIP, 1005, ROH
MLK1005S15NJTD25	TDK	获取价格	General Purpose Inductor,
MLK1005S15NT	TDK	获取价格	Inductors for High Frequency
MLK1005S18NJ	TDK	获取价格	General Purpose Inductor, 0.018uH, 5%, 1 Element, Ceramic-Core, SMD, 0402, CHIP, 0402, ROH
MLK1005S18NJJT	TDK	获取价格	General Purpose Inductor, 0.018uH, 5%, 1 Element, Ceramic-Core, SMD, 1005, CHIP, 1005, ROH
MLK1005S18NJT	TDK	获取价格	SMD Inductors For High Frequency
MLK1005S18NJT000	TDK	获取价格	Inductors (Coils)
MLK1005S18NJTD25	TDK	获取价格	Inductors (Coils)
MLK1005S18NT	TDK	获取价格	Inductors for High Frequency

与MLK1005S15NJ相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

38
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

30
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

58
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

54

产品中心

服务支持

精选活动

关于我们

帮助中心

MLK1005S15NJ

MLK1005S15NJ 数据手册

MLK1005S15NJ 替代型号

与MLK1005S15NJ相关器件

与MLK1005S15NJ相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MLK1005S15NJ

MLK1005S15NJ 数据手册

MLK1005S15NJ 替代型号

与MLK1005S15NJ相关器件

与MLK1005S15NJ相关文章

您还可以找

您在本页遇到什么问题？