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MKL05Z16VFK4 PDF预览

MKL05Z16VFK4

更新时间: 2024-11-22 15:18:27
品牌 Logo 应用领域
恩智浦 - NXP 微控制器
页数 文件大小 规格书
53页 995K
描述
Kinetis® KL0x-48 MHz, Entry-Level Ultra-Low Power Microcontrollers (MCUs) based on A...

MKL05Z16VFK4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred包装说明:HVQCCN, LCC24,.16SQ,20
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.65
具有ADC:YES其他特性:12-BIT ADC AND 12-BIT DAC AVAILABLE
地址总线宽度:位大小:32
CPU系列:CORTEX-M0最大时钟频率:32 MHz
DAC 通道:YESDMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-XQCC-N24
长度:4 mm湿度敏感等级:3
I/O 线路数量:22端子数量:24
片上程序ROM宽度:8最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC24,.16SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:1.8/3.3 V认证状态:Not Qualified
RAM(字节):2048ROM(单词):16384
ROM可编程性:FLASH座面最大高度:1 mm
速度:48 MHz子类别:Microcontrollers
最大压摆率:6.8 mA最大供电电压:3.6 V
最小供电电压:1.71 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:4 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

MKL05Z16VFK4 数据手册

 浏览型号MKL05Z16VFK4的Datasheet PDF文件第2页浏览型号MKL05Z16VFK4的Datasheet PDF文件第3页浏览型号MKL05Z16VFK4的Datasheet PDF文件第4页浏览型号MKL05Z16VFK4的Datasheet PDF文件第5页浏览型号MKL05Z16VFK4的Datasheet PDF文件第6页浏览型号MKL05Z16VFK4的Datasheet PDF文件第7页 
Freescale Semiconductor, Inc.  
Data Sheet: Technical Data  
KL05P48M48SF1  
Rev 4 03/2014  
Kinetis KL05 32 KB Flash  
MKL05ZxxVFK4  
48 MHz Cortex-M0+ Based Microcontroller  
MKL05ZxxVLC4  
MKL05ZxxVFM4  
MKL05ZxxVLF4  
Designed with efficiency in mind. Features a size efficient, small  
package, energy efficient ARM Cortex-M0+ 32-bit performance.  
Shares the comprehensive enablement and scalability of the  
Kinetis family.  
This product offers:  
• Run power consumption down to 45 μA/MHz in very low  
power run mode  
24-pin QFN (FK)  
4 x 4 x 1 Pitch 0.5 mm 5 x 5 x 1 Pitch 0.5 mm  
32-pin QFN (FM)  
• Static power consumption down to 2 μA with full state  
retention and 4 μs wakeup  
• Ultra-efficient Cortex-M0+ processor running up to 48MHz  
with industry leading throughput  
• Memory option is up to 32 KB Flash and 4 KB RAM  
• Energy-saving architecture is optimized for low power with  
90 nm TFS technology, clock and power gating techniques,  
and zero wait state flash memory controller  
32-pin LQFP (LC)  
7 x 7 x 1.4 Pitch 0.8  
mm  
48-pin LQFP (LF)  
7 x 7 x 1.4 Pitch 0.5  
mm  
Performance  
• 48 MHz ARM® Cortex®-M0+ core  
Human-machine interface  
• Low-power hardware touch sensor interface (TSI)  
• Up to 41 general-purpose input/output (GPIO)  
Memories and memory interfaces  
• Up to 32 KB program flash memory  
• Up to 4 KB SRAM  
Communication interfaces  
• One 8-bit SPI module  
• One low power UART module  
• One I2C module  
System peripherals  
• Nine low-power modes to provide power optimization  
based on application requirements  
• COP Software watchdog  
• 4-channel DMA controller, supporting up to 63 request  
sources  
• Low-leakage wakeup unit  
• SWD debug interface and Micro Trace Buffer  
• Bit Manipulation Engine  
Analog Modules  
• 12-bit SAR ADC  
• 12-bit DAC  
• Analog comparator (CMP) containing a 6-bit DAC  
and programmable reference input  
Timers  
• Six channel Timer/PWM (TPM)  
• One 2-channel Timer/PWM module  
• Periodic interrupt timers  
• 16-bit low-power timer (LPTMR)  
• Real time clock  
Clocks  
• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator  
• Multi-purpose clock source  
• 1 kHz LPO clock  
Operating Characteristics  
Security and integrity modules  
• Voltage range: 1.71 to 3.6 V  
• 80-bit unique identification number per chip  
• Flash write voltage range: 1.71 to 3.6 V  
• Temperature range (ambient): -40 to 105°C  
Freescale reserves the right to change the detail specifications as may be required to  
permit improvements in the design of its products. © 2012–2014 Freescale  
Semiconductor, Inc. All rights reserved.  

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