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MKE11R600DCGFC PDF预览

MKE11R600DCGFC

更新时间: 2024-09-25 20:09:27
品牌 Logo 应用领域
力特 - LITTELFUSE 局域网开关晶体管
页数 文件大小 规格书
6页 217K
描述
Power Field-Effect Transistor, 15A I(D), 600V, 0.165ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ISOPLUS I4, 5 PIN

MKE11R600DCGFC 技术参数

生命周期:Not Recommended包装说明:IN-LINE, R-PSIP-T5
Reach Compliance Code:compliant风险等级:5.38
其他特性:AVALANCHE RATED, HIGH RELIABILITY, UL RECOGNIZED雪崩能效等级(Eas):522 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):15 A
最大漏极电流 (ID):15 A最大漏源导通电阻:0.165 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T5
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE极性/信道类型:N-CHANNEL
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

MKE11R600DCGFC 数据手册

 浏览型号MKE11R600DCGFC的Datasheet PDF文件第2页浏览型号MKE11R600DCGFC的Datasheet PDF文件第3页浏览型号MKE11R600DCGFC的Datasheet PDF文件第4页浏览型号MKE11R600DCGFC的Datasheet PDF文件第5页浏览型号MKE11R600DCGFC的Datasheet PDF文件第6页 
MKE 11R600DCGFC  
CoolMOS™ 1) Power MOSFET  
with SiC Diode  
Boost topology  
ID25  
VDSS  
=
15 A  
= 600 V  
RDS(on) max = 0.165 Ω  
ISOPLUS i4™  
3
Electrically isolated back surface  
2500 V electrical isolation  
SiC  
D
T
4
1
2
1

isolated back  
surface  
E72873  
5
Features  
MOSFET T  
• Silicon chip on Direct-Copper-Bond  
substrate  
Symbol  
VDSS  
Conditions  
Maximum Ratings  
TVJ = 25°C  
600  
20  
V
- high power dissipation  
- isolated mounting surface  
- 2500 V electrical isolation  
- low drain to tab capacitance (< 40 pF)  
• Fast CoolMOS™ 1) power MOSFET 4th  
generation  
VGS  
V
ID25  
ID90  
TC = 25°C  
TC = 90°C  
15  
11  
A
A
EAS  
EAR  
single pulse  
repetitive  
522  
0.79  
mJ  
mJ  
ID = 7.9 A; TC = 25°C  
- high blocking capability  
- lowest resistance  
dV/dt  
MOSFET dV/dt ruggedness VDS = 0...480 V  
50 V/ns  
- avalanche rated for unclamped  
inductive switching (UIS)  
- low thermal resistance  
due to reduced chip thickness  
• Enhanced total power density  
• SiC Boost Diode  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min.  
2.5  
typ. max.  
- no reverse recovery current  
RDSon  
VGS(th)  
IDSS  
VGS = 10 V; ID = 12 A  
VDS = VGS; ID = 0.79 mA  
VDS = 600 V; VGS = 0 V  
150  
3
165  
3.5  
1
mW  
V
Applications  
TVJ = 25°C  
TVJ = 125°C  
µA  
µA  
• Switched mode power supplies (SMPS)  
• Uninterruptible power supplies (UPS)  
• Power factor correction (PFC)  
10  
IGSS  
VGS  
=
20 V; VDS = 0 V  
100  
52  
nA  
Ciss  
Coss  
VGS = 0 V; VDS = 100 V  
f = 1 MHz  
2000  
100  
pF  
pF  
Advantages  
• Easy assembly:  
no screws or isolation foils required  
• Space savings  
• High power density  
• High reliability  
Qg  
Qgs  
Qgd  
40  
9
13  
nC  
nC  
nC  
VGS = 0 to 10 V; VDS = 400 V; ID = 12 A  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
Erec off  
12  
6
ns  
ns  
1) CoolMOSis a trademark of  
Infineon Technologies AG.  
Inductive switching  
VGS = 0/10 V; VDS = 380 V  
ID = 12 A; RG = 10 W  
TVJ = 125°C  
75  
ns  
4
ns  
0.09  
0.01  
mJ  
mJ  
mJ  
no reverse recovery current due to absence of minority carrier injection  
RthJC  
RthJH  
1.1 K/W  
K/W  
with heat transfer paste (IXYS test setup)  
1.35  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2010 IXYS All rights reserved  
20100920a  
1 - 6  

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