Table of Contents
1 Ordering parts...........................................................................3
5.4.2 Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1 Debug trace timing specifications.........................22
6.1.2 JTAG electricals....................................................23
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1 MCG specifications...............................................25
6.3.2 Oscillator electrical specifications.........................28
6.3.3 32kHz Oscillator Electrical Characteristics............30
6.4 Memories and memory interfaces.....................................31
6.4.1 Flash electrical specifications................................31
6.4.2 EzPort Switching Specifications............................35
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
6.6.1 ADC electrical specifications.................................37
6.6.2 CMP and 6-bit DAC electrical specifications.........45
6.6.3 12-bit DAC electrical characteristics.....................47
6.6.4 Voltage reference electrical specifications............50
6.7 Timers................................................................................51
6.8 Communication interfaces.................................................52
6.8.1 CAN switching specifications................................52
6.8.2 DSPI switching specifications (limited voltage
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................10
5.1 AC electrical characteristics..............................................10
5.2 Nonswitching electrical specifications...............................10
5.2.1 Voltage and current operating requirements.........10
5.2.2 LVD and POR operating requirements.................12
5.2.3 Voltage and current operating behaviors..............12
5.2.4 Power mode transition operating behaviors..........13
5.2.5 Power consumption operating behaviors..............14
5.2.6 Designing with radiated emissions in mind...........18
5.2.7 Capacitance attributes..........................................18
5.3 Switching specifications.....................................................19
5.3.1 Device clock specifications...................................19
5.3.2 General switching specifications...........................19
5.4 Thermal specifications.......................................................20
5.4.1 Thermal operating requirements...........................20
range)....................................................................52
6.8.3 DSPI switching specifications (full voltage range).53
6.8.4 I2C switching specifications..................................55
6.8.5 UART switching specifications..............................55
6.8.6 I2S/SAI Switching Specifications..........................55
6.9 Human-machine interfaces (HMI)......................................60
6.9.1 TSI electrical specifications...................................60
6.9.2 LCD electrical characteristics................................61
7 Dimensions...............................................................................62
7.1 Obtaining package dimensions.........................................62
8 Pinout........................................................................................63
8.1 K30 Signal Multiplexing and Pin Assignments..................63
8.2 K30 Pinouts.......................................................................68
9 Revision History........................................................................70
K30 Sub-Family Data Sheet, Rev. 2, 4/2012.
2
Freescale Semiconductor, Inc.
5秒后页面跳转
STM32H743技术深度剖析与应用案例探索
LM321中文资料解析：引脚功能介绍、技术特点、技术特性分析
74HC14芯片资料介绍：性能特性分析、引脚介绍
LM1875芯片手册：功放参数分析、引脚说明、电路设计要点
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
