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MK30DN512ZVMB10R PDF预览

MK30DN512ZVMB10R

更新时间: 2024-02-09 05:44:11
品牌 Logo 应用领域
恩智浦 - NXP 时钟微控制器外围集成电路
页数 文件大小 规格书
69页 1787K
描述
32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA81, 8 X 8 MM, MAPBGA-81

MK30DN512ZVMB10R 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:LFBGA, BGA81,11X11,25针数:81
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.7
具有ADC:YES地址总线宽度:
位大小:32CPU系列:CORTEX-M4
最大时钟频率:32 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PBGA-B81长度:8 mm
端子数量:81最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA81,11X11,25封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH电源:1.8/3.3 V
认证状态:Not QualifiedRAM(字节):131072
ROM(单词):524288ROM可编程性:FLASH
座面最大高度:1.52 mm速度:100 MHz
子类别:Microcontrollers最大压摆率:87 mA
最大供电电压:3.6 V最小供电电压:1.71 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.65 mm
端子位置:BOTTOM宽度:8 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

MK30DN512ZVMB10R 数据手册

 浏览型号MK30DN512ZVMB10R的Datasheet PDF文件第1页浏览型号MK30DN512ZVMB10R的Datasheet PDF文件第3页浏览型号MK30DN512ZVMB10R的Datasheet PDF文件第4页浏览型号MK30DN512ZVMB10R的Datasheet PDF文件第5页浏览型号MK30DN512ZVMB10R的Datasheet PDF文件第6页浏览型号MK30DN512ZVMB10R的Datasheet PDF文件第7页 
Table of Contents  
1 Ordering parts...........................................................................3  
5.4.2 Thermal attributes.................................................21  
6 Peripheral operating requirements and behaviors....................22  
6.1 Core modules....................................................................22  
6.1.1 Debug trace timing specifications.........................22  
6.1.2 JTAG electricals....................................................23  
6.2 System modules................................................................26  
6.3 Clock modules...................................................................26  
6.3.1 MCG specifications...............................................26  
6.3.2 Oscillator electrical specifications.........................28  
6.3.3 32 kHz Oscillator Electrical Characteristics...........30  
6.4 Memories and memory interfaces.....................................31  
6.4.1 Flash electrical specifications................................31  
6.4.2 EzPort Switching Specifications............................33  
6.5 Security and integrity modules..........................................34  
6.6 Analog...............................................................................34  
6.6.1 ADC electrical specifications.................................34  
6.6.2 CMP and 6-bit DAC electrical specifications.........41  
6.6.3 12-bit DAC electrical characteristics.....................44  
6.6.4 Voltage reference electrical specifications............47  
6.7 Timers................................................................................48  
6.8 Communication interfaces.................................................48  
6.8.1 CAN switching specifications................................48  
6.8.2 DSPI switching specifications (limited voltage  
1.1 Determining valid orderable parts......................................3  
2 Part identification......................................................................3  
2.1 Description.........................................................................3  
2.2 Format...............................................................................3  
2.3 Fields.................................................................................3  
2.4 Example............................................................................4  
3 Terminology and guidelines......................................................4  
3.1 Definition: Operating requirement......................................4  
3.2 Definition: Operating behavior...........................................5  
3.3 Definition: Attribute............................................................5  
3.4 Definition: Rating...............................................................6  
3.5 Result of exceeding a rating..............................................6  
3.6 Relationship between ratings and operating  
requirements......................................................................6  
3.7 Guidelines for ratings and operating requirements............7  
3.8 Definition: Typical value.....................................................7  
3.9 Typical value conditions....................................................8  
4 Ratings......................................................................................9  
4.1 Thermal handling ratings...................................................9  
4.2 Moisture handling ratings..................................................9  
4.3 ESD handling ratings.........................................................9  
4.4 Voltage and current operating ratings...............................9  
5 General.....................................................................................10  
5.1 AC electrical characteristics..............................................10  
5.2 Nonswitching electrical specifications...............................10  
5.2.1 Voltage and current operating requirements.........10  
5.2.2 LVD and POR operating requirements.................11  
5.2.3 Voltage and current operating behaviors..............12  
5.2.4 Power mode transition operating behaviors..........14  
5.2.5 Power consumption operating behaviors..............15  
5.2.6 EMC radiated emissions operating behaviors.......18  
5.2.7 Designing with radiated emissions in mind...........19  
5.2.8 Capacitance attributes..........................................19  
5.3 Switching specifications.....................................................19  
5.3.1 Device clock specifications...................................19  
5.3.2 General switching specifications...........................19  
5.4 Thermal specifications.......................................................20  
5.4.1 Thermal operating requirements...........................20  
range)....................................................................49  
6.8.3 DSPI switching specifications (full voltage range).50  
6.8.4 Inter-Integrated Circuit Interface (I2C) timing........52  
6.8.5 UART switching specifications..............................53  
6.8.6 SDHC specifications.............................................53  
6.8.7 I2S switching specifications..................................54  
6.9 Human-machine interfaces (HMI)......................................57  
6.9.1 TSI electrical specifications...................................57  
6.9.2 LCD electrical characteristics................................58  
7 Dimensions...............................................................................59  
7.1 Obtaining package dimensions.........................................59  
8 Pinout........................................................................................59  
8.1 K30 Signal Multiplexing and Pin Assignments..................59  
8.2 K30 Pinouts.......................................................................64  
9 Revision History........................................................................66  
K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.  
2
Freescale Semiconductor, Inc.  

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