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MK22FN256VMP12 PDF预览

MK22FN256VMP12

更新时间: 2024-02-22 03:30:17
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
76页 959K
描述
Kinetis K22F 256 KB Flash

MK22FN256VMP12 技术参数

生命周期:Transferred包装说明:BGA,
Reach Compliance Code:unknown风险等级:5.7
具有ADC:YES地址总线宽度:
最大时钟频率:50 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PBGA-B64I/O 线路数量:40
端子数量:64最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
ROM可编程性:FLASH速度:120 MHz
最大供电电压:3.6 V最小供电电压:1.71 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子位置:BOTTOM
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

MK22FN256VMP12 数据手册

 浏览型号MK22FN256VMP12的Datasheet PDF文件第2页浏览型号MK22FN256VMP12的Datasheet PDF文件第3页浏览型号MK22FN256VMP12的Datasheet PDF文件第4页浏览型号MK22FN256VMP12的Datasheet PDF文件第5页浏览型号MK22FN256VMP12的Datasheet PDF文件第6页浏览型号MK22FN256VMP12的Datasheet PDF文件第7页 
NXP Semiconductors  
Data Sheet: Technical Data  
K22P121M120SF8  
Rev. 7, 08/2016  
Kinetis K22F 256 KB Flash  
MK22FN256VDC12  
120 MHz ARM® Cortex®-M4-Based Microcontroller with FPU  
MK22FN256VLL12  
MK22FN256VMP12  
MK22FN256VLH12  
The Kinetis K22 product family members are optimized for cost-  
sensitive applications requiring low-power, USB connectivity,  
high peripheral integration and processing efficiency with floating  
point unit. These devices share the comprehensive enablement  
and scalability of the Kinetis family.  
121 XFBGA (DC)  
100 LQFP (LL)  
This product offers:  
8 x 8 x 0.5 Pitch 0.65 14 x 14 x 1.4 Pitch 0.5  
• Run power consumption down to 153 µA/MHz and static  
power consumption down to 2.6 µA with full state retention  
and 6 µs wakeup. Lowest static mode down to 120 nA  
• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO  
voltage regulator. USB FS device crystal-less functionality.  
mm  
mm  
64 MAPBGA (MP)  
64 LQFP (LH)  
5 x 5 x 1.2 Pitch 0.5 10 x 10 x 1.4 Pitch 0.5  
mm mm  
Performance  
• 120 MHz ARM Cortex-M4 core with DSP instructions  
Analog modules  
• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)  
• One 12-bit DAC  
delivering 1.25 Dhrystone MIPS per MHz  
• Two analog comparators (CMP) with 6- bit DAC  
• Accurate internal voltage reference  
Memories and memory interfaces  
• 256 KB of embedded flash and 48 KB of RAM  
• Serial programming interface (EzPort)  
• Preprogrammed Kinetis flashloader for one-time, in-  
system factory programming  
Communication interfaces  
• USB LS/FS OTG 2.0 with on-chip transceiver and  
USB LDO voltage regulator  
• USB full-speed device crystal-less operation  
• Two SPI modules  
• Three UART modules and one low-power UART  
• Two I2C modules: Support for up to 1 Mbps  
operation  
System peripherals  
• Flexible low-power modes, multiple wake up sources  
• 16-channel DMA controller  
• Independent external and software watchdog monitor  
• I2S module  
Clocks  
• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or  
3-32 MHz  
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz  
• Multi-purpose clock generator with PLL and FLL  
Timers  
• One 8-channel general purpose/ PWM timer  
• Two 2-channel general purpose timers with  
quadrature decoder functionality  
• Periodic interrupt timers  
• 16-bit low-power timer  
• Real-time clock with independent power domain  
• Programmable delay block  
Security and integrity modules  
• Hardware CRC module  
• 128-bit unique identification (ID) number per chip  
• Hardware random-number generator  
• Flash access control to protect proprietary software  
Operating Characteristics  
• Voltage range (including flash writes): 1.71 to 3.6 V  
• Temperature range (ambient): -40 to 105°C  
Human-machine interface  
• Up to 70 general-purpose I/O (GPIO)  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

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