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MIMXRT1165DVM6A PDF预览

MIMXRT1165DVM6A

更新时间: 2024-11-21 15:18:27
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
128页 2844K
描述
i.MX RT1160 crossover MCU, Arm Cortex-M7

MIMXRT1165DVM6A 数据手册

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Document Number:IMXRT1160CEC  
Rev. 3, 06/2023  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1166DVM6A  
MIMXRT1165DVM6A  
i.MX RT1160 Crossover  
Processors Data Sheet  
for Consumer Products  
Package Information  
Plastic Package  
289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch  
Ordering Information  
See Table 1 on page 6  
1. i.MX RT1160 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6  
1.3. Package marking information . . . . . . . . . . . . . . . . 9  
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
3.1. Special signal considerations . . . . . . . . . . . . . . . 20  
3.2. Recommended connections for unused analog  
1 i.MX RT1160 introduction  
The i.MX RT1160 is a new high-end processor of the  
i.MX RT family, which features NXP’s advanced  
implementation of a high performance Arm  
®
Cortex -M7 core operating at speeds up to 600 MHz  
®
and a power efficient Cortex -M4 core up to 240 MHz.  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24  
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 24  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 33  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 52  
4.5. External memory interface . . . . . . . . . . . . . . . . . 57  
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 66  
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72  
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74  
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 83  
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99  
The i.MX RT1160 processor has 1 MB on-chip RAM in  
total, including a 768 KB RAM which can be flexibly  
configured as TCM (512 KB RAM shared with M7 TCM  
and 256 KB RAM shared with M4 TCM) or  
general-purpose on-chip RAM. The i.MX RT1160  
integrates advanced power management module with  
DCDC and LDO regulators that reduce complexity of  
external power supply and simplifies power sequencing.  
The i.MX RT1160 also provides various memory  
interfaces, including SDRAM, RAW NAND FLASH,  
NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper  
RAM/Flash, and a wide range of other interfaces for  
connecting peripherals, such as WLAN, Bluetooth™,  
5.  
Boot mode configuration . . . . . . . . . . . . . . . . . . 101  
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 101  
5.1. Boot mode configuration pins . . . . . . . . . . . . . . 101  
5.2. Boot device interface allocation . . . . . . . . . . . . . 101  
6. Package information and contact assignments . . . . . . 107  
6.1. 14 x 14 mm package information . . . . . . . . . . . 107  
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122  
NXP reserves the right to change the production detail specifications as may be required  
to permit improvements in the design of its products.  
© 2023 NXP B.V.  

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