MIC5209
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
Lead Temperature
TS
—
TJ
TJ
–65
—
—
—
—
—
+150
+260
+125
+125
°C
°C
°C
°C
—
Soldering, 5 sec.
2.5V ≤ VOUT ≤ 15V
1.8V ≤ VOUT < 2.5V
Junction Temperature
–40
0
Junction Temperature
Package Thermal Resistance
θJA
θJC
θJA
θJC
θJA
θJC
θJA
θJC
—
—
—
—
—
—
—
—
62
15
50
25
31.4
3
—
—
—
—
—
—
—
—
°C/W EIA/JEDEC
JES51-751-7,
Thermal Resistance SOT-223
Thermal Resistance SOIC-8
Thermal Resistance DDPAK
°C/W
4 Layer Board
°C/W See Thermal
Considerations for more
information.
°C/W
°C/W EIA/JEDEC
JES51-751-7,
°C/W
4 Layer Board
64
12
°C/W EIA/JEDEC
JES51-751-7,
Thermal Resistance 3 mm x 3 mm
VDFN
°C/W
4 Layer Board
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
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DS20005720B-page 7