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MIC5209 PDF预览

MIC5209

更新时间: 2023-12-06 20:11:24
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
30页 2816K
描述
The MIC5209 is an efficient linear voltage regulator with very low dropout voltage, typically 10mV

MIC5209 数据手册

 浏览型号MIC5209的Datasheet PDF文件第4页浏览型号MIC5209的Datasheet PDF文件第5页浏览型号MIC5209的Datasheet PDF文件第6页浏览型号MIC5209的Datasheet PDF文件第8页浏览型号MIC5209的Datasheet PDF文件第9页浏览型号MIC5209的Datasheet PDF文件第10页 
MIC5209  
TEMPERATURE SPECIFICATIONS (Note 1)  
Parameters  
Temperature Ranges  
Sym.  
Min.  
Typ.  
Max.  
Units  
Conditions  
Storage Temperature Range  
Lead Temperature  
TS  
TJ  
TJ  
–65  
+150  
+260  
+125  
+125  
°C  
°C  
°C  
°C  
Soldering, 5 sec.  
2.5V ≤ VOUT ≤ 15V  
1.8V ≤ VOUT < 2.5V  
Junction Temperature  
–40  
0
Junction Temperature  
Package Thermal Resistance  
θJA  
θJC  
θJA  
θJC  
θJA  
θJC  
θJA  
θJC  
62  
15  
50  
25  
31.4  
3
°C/W EIA/JEDEC  
JES51-751-7,  
Thermal Resistance SOT-223  
Thermal Resistance SOIC-8  
Thermal Resistance DDPAK  
°C/W  
4 Layer Board  
°C/W See Thermal  
Considerations for more  
information.  
°C/W  
°C/W EIA/JEDEC  
JES51-751-7,  
°C/W  
4 Layer Board  
64  
12  
°C/W EIA/JEDEC  
JES51-751-7,  
Thermal Resistance 3 mm x 3 mm  
VDFN  
°C/W  
4 Layer Board  
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable  
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the  
maximum allowable power dissipation will cause the device operating junction temperature to exceed the  
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  
2017 - 2022 Microchip Technology Inc. and its subsidiaries  
DS20005720B-page 7  

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