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MDC3105_16 PDF预览

MDC3105_16

更新时间: 2024-12-01 00:34:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
14页 185K
描述
Integrated Relay, Inductive Load Driver

MDC3105_16 数据手册

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MDC3105  
Integrated Relay,  
Inductive Load Driver  
This device is intended to replace an array of three to six discrete  
components with an integrated SMT part. It is available in a SOT−23  
package. It can be used to switch 3 to 6 Vdc inductive loads such as  
relays, solenoids, incandescent lamps, and small DC motors without  
the need of a free−wheeling diode.  
www.onsemi.com  
Features  
Relay, Inductive Load Driver  
Provides a Robust Driver Interface between DC Relay Coil and  
Sensitive Logic Circuits  
MARKING  
DIAGRAMS  
Optimized to Switch Relays from a 3.0 V to 5.0 V Rail  
Capable of Driving Relay Coils Rated up to 2.5 W at 5.0 V  
Features Low Input Drive Current and Good Back−to−Front Transient  
SOT−23  
CASE 318  
STYLE 6  
Isolation  
JW M G  
Internal Zener Eliminates Need for Free−Wheeling Diode  
Internal Zener Clamp Routes Induced Current to Ground for Quieter  
System Operation  
G
1
1
Guaranteed Off State with No Input Connection  
Supports Large Systems with Minimal Off−State Leakage  
SC−74  
CASE 318F  
STYLE 8  
JW M G  
ESD Resistant in Accordance with the Class 1C Human Body Model  
6
G
1
Low Sat Voltage Reduces System Current Drain by Allowing Use of  
1
Higher Resistance Relay Coils  
Pb−Free Packages are Available  
Applications  
SOT−563  
CASE 463A  
STYLE 4  
JW M G  
Telecom: Line Cards, Modems, Answering Machines, FAX  
Machines, Feature Phone Electronic Hook Switch  
Computer and Office: Photocopiers, Printers, Desktop Computers  
Consumer: TVs and VCRs, Stereo Receivers, CD Players, Cassette  
Recorders, TV Set Top Boxes  
Industrial: Small Appliances, White Goods, Security Systems,  
Automated Test Equipment, Garage Door Openers  
Automotive: 5.0 V Driven Relays, Motor Controls, Power Latches,  
Lamp Drivers  
G
1
JW  
M
G
= Specific Device Code  
= Date Code*  
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
© Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
October, 2016 − Rev. 8  
MDC3105/D  

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