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MCZ33927R2 PDF预览

MCZ33927R2

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 晶体驱动器晶体管场效应晶体管
页数 文件大小 规格书
44页 535K
描述
Three-Phase Field Effect Transistor Pre-Driver

MCZ33927R2 数据手册

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ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings (continued)  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
THERMAL RATINGS  
Storage Temperature  
TSTG  
TJ  
-55 to +150  
-40 to +150  
°C  
°C  
Operating Junction Temperature  
Thermal Resistance(5)  
Junction-to-Case  
°C/W  
RθJC  
3.0  
Soldering Temperature(6)  
TSOLDER  
Note 7  
°C  
Notes  
5. Case is considered EP - pin 55 under the body of the device. The actual power dissipation of the device is dependent on the operating  
mode, the heat transfer characteristics of the board and layout and the operating voltage. See Figure 19 and Figure 20 for examples of  
power dissipation profiles of two common configurations. Operation above the maximum operating junction temperature will result in a  
reduction in reliability leading to malfunction or permanent damage to the device.  
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may  
cause malfunction or permanent damage to the device.  
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow  
Temperature and Moisture Sensitivity Levels (MSL),  
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.  
MC33xxxD enter 33xxx), and review parametrics.  
33927  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
7

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