Document Number: MC33689
Rev. 7.0, 8/2006
Freescale Semiconductor
Technical Data
System Basis Chip with LIN
Transceiver
33689D
The 33689 is a SPI-controlled System Basis Chip (SBC) that
combines many frequently used functions in an MCU-based system
plus a Local Interconnect Network (LIN) transceiver. Applications
include power window, mirror, and seat controls. The 33689 has a
5.0 V, 50 mA low dropout regulator with full protection and reporting
features. The device provide full SPI-readable diagnostics and a
selectable timing watchdog for detecting errant operation.
SYSTEM BASIS CHIP WITH LIN
The LIN transceiver waveshaping circuitry can be disabled for
higher data rates. One 50 mA and two 150 mA high-side switches with
output protection are available to drive inductive or resistive loads. The
150 mA switches can be pulse-width modulated (PWM).
Two high-voltage inputs are available for contact monitoring or as
external wake-up inputs. A current sense operational amplifier is
available for load current monitoring.
DWB SUFFIX
EW SUFFIX (PB-FREE)
98ARH99137A
The 33689 has three operational modes:
• Normal (all functions available)
• Sleep (VDD OFF, wake-up via LIN bus or wake-up inputs)
• Stop (VDD ON, wake-up via MCU, LIN bus, or wake-up inputs)
32-PIN SOICW
Features
ORDERING INFORMATION
Temperature
• Full-Duplex SPI Interface at Frequencies up to 4.0 MHz
• LIN Transceiver Capable to 100 kbps with Waveshaping Capability
• 5.0 V Low Dropout Regulator Full Fault Detection and Protection
• One 50 mA and Two 150 mA Protected High-Side Switches
• Current Sense Operational Amplifier
Device
Package
Range (T )
A
MC33689DDWB/R2
MCZ33689DEW/R2
-40°C to 125°C
32 SOICW
• The 33689 is compatible with LIN 2.0 Specification Package.
• Pb-Free Packaging Designated by Suffix Code EW
V
V
DD PWR
33689
VS1
VS2
VCC
VDD
WDC
HS3
L1
L2
5.0 V
HS1
HS2
CS
SCK
MOSI
MISO
CS
SCLK
MOSI
MISO
INT
RST
IN
OUT
TXD
RXD
MCU
SPI
E+
E-
GND
TGND
AGND
LIN
BUS
Figure 1. 33689 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as
may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2006. All rights reserved.