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MCZ1210CT201T PDF预览

MCZ1210CT201T

更新时间: 2024-11-21 03:49:59
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
2页 49K
描述
Chip Beads(SMD Array) For Audio Signal Line

MCZ1210CT201T 数据手册

 浏览型号MCZ1210CT201T的Datasheet PDF文件第2页 
(1/2)  
Conformity to RoHS Directive  
Chip Beads(SMD Array)  
For Audio Signal Line  
MCZ Series MCZ1210-T Type(3-Line)  
This is a common type bead product that removes the noise  
components in a signal line and includes beads for three lines in a  
single chip. The product exhibits substantial impedance character-  
istics in the high frequency range and is therefore capable of effec-  
tively removing differential mode noises.  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD  
PATTERN  
1.25 0.1  
0.225  
6
5
4
Additionally, an appropriate amount of magnetic coupling is creat-  
ed between the beads of the three lines, giving the product the  
capability to remove not only differential mode noise but common  
mode noise as well. It is encased in a 1210 casing. This is an SMD  
product that allows for automatic mounting by taping.  
1
2
3
0.225 0.1  
0.25  
Dimensions in mm  
FEATURES  
• Compact size and for three lines  
0.475 0.1  
• Capable of removing both common and differential mode noises.  
• Closed magnetic circuit structure allows high-density installation  
while preventing crosstalk between circuits.  
CIRCUIT DIAGRAM  
6
5
4
APPLICATIONS  
Audio signal lines used in cell phones and mobile audio devices.  
1
2
3
PRODUCT IDENTIFICATION  
• No polarity  
MCZ 1210  
C
T 201 T  
(1) (2) (3) (4) (5) (6)  
TEMPERATURE RANGES  
Operating/Storage  
–40 to +85°C  
(1) Series name  
(2) Dimensions L× W  
(3) Material code  
(4) Number of line  
(5) Impedance  
PACKAGING STYLE AND QUANTITIES  
Packaging style  
Quantity  
Taping  
4000 pieces/reel  
201: 200at 100MHz  
(6) Packaging style  
T:Taping  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components. The preheat-  
ing temperature should be set so that the temperature difference  
between the solder temperature and product temperature does  
not exceed 150°C.  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• The inductance value may change due to magnetic saturation if  
the current exceeds the rated maximum.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
001-05 / 20061022 / e9421_mcz1210_3.

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