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MCP25050-E/P PDF预览

MCP25050-E/P

更新时间: 2024-02-29 23:34:22
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
56页 589K
描述
SPECIALTY MICROPROCESSOR CIRCUIT, PDIP14, 0.300 INCH, PLASTIC, DIP-14

MCP25050-E/P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:SOIC
包装说明:SOIC-14针数:14
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:18 weeks
风险等级:5.23JESD-30 代码:R-PDSO-G14
JESD-609代码:e3长度:8.65 mm
湿度敏感等级:1位数:8
端子数量:14最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP14,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260电源:3/5 V
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:Parallel IO Port最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:3.9 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT

MCP25050-E/P 数据手册

 浏览型号MCP25050-E/P的Datasheet PDF文件第1页浏览型号MCP25050-E/P的Datasheet PDF文件第3页浏览型号MCP25050-E/P的Datasheet PDF文件第4页浏览型号MCP25050-E/P的Datasheet PDF文件第5页浏览型号MCP25050-E/P的Datasheet PDF文件第6页浏览型号MCP25050-E/P的Datasheet PDF文件第7页 
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