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MCP23S08 PDF预览

MCP23S08

更新时间: 2024-02-11 18:01:09
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
40页 500K
描述
8-Bit I/O Expander with Serial Interface

MCP23S08 技术参数

生命周期:Active包装说明:SOIC-18
Reach Compliance Code:compliant风险等级:5.74
Is Samacsys:NJESD-30 代码:R-PDSO-G18
长度:11.53 mmI/O 线路数量:8
端口数量:1端子数量:18
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
筛选级别:AEC-Q100座面最大高度:2.65 mm
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:7.5 mm
uPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSEBase Number Matches:1

MCP23S08 数据手册

 浏览型号MCP23S08的Datasheet PDF文件第32页浏览型号MCP23S08的Datasheet PDF文件第33页浏览型号MCP23S08的Datasheet PDF文件第34页浏览型号MCP23S08的Datasheet PDF文件第36页浏览型号MCP23S08的Datasheet PDF文件第37页浏览型号MCP23S08的Datasheet PDF文件第38页 
MCP23008/MCP23S08  
APPENDIX A: REVISION HISTORY  
Revision B (February 2005)  
The following is the list of modifications:  
1. Section 1.6 “Configuration and Control Reg-  
isters”. Added Hardware Address Enable  
(HAEN) bit to Table 1-3.  
2. Section 1.6.6 “Configuration (IOCON) Regis-  
ter”. Added Hardware Address Enable (HAEN)  
bit to Register 1-6.  
Revision A (December 2004)  
Original Release of this Document.  
© 2005 Microchip Technology Inc.  
DS21919B-page 35  

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