是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SSOP |
包装说明: | 5.30 MM, LEAD FREE, PLASTIC, SSOP-20 | 针数: | 20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.51 |
JESD-30 代码: | R-PDSO-G20 | JESD-609代码: | e3 |
长度: | 7.2 mm | 湿度敏感等级: | 1 |
I/O 线路数量: | 8 | 端口数量: | 1 |
端子数量: | 20 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 2 mm |
最大供电电压: | 5.5 V | 最小供电电压: | 1.8 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | MATTE TIN (SN) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 5.3 mm |
uPs/uCs/外围集成电路类型: | PARALLEL IO PORT, GENERAL PURPOSE |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MCP23S09-E/MG | MICROCHIP | 8 I/O, PIA-GENERAL PURPOSE, PQCC16, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, QFN-16 |
获取价格 |
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MCP23S09-E/P | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09-E/SO | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09-E/SS | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09EMG | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09EP | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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