是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, QFN-16 | 针数: | 16 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 1.24 | JESD-30 代码: | S-PQCC-N16 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 1 | 位数: | 8 |
I/O 线路数量: | 8 | 端口数量: | 1 |
端子数量: | 16 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC16,.12SQ,20 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 2/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
子类别: | Parallel IO Port | 最大供电电压: | 5.5 V |
最小供电电压: | 1.8 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 3 mm | uPs/uCs/外围集成电路类型: | PARALLEL IO PORT, GENERAL PURPOSE |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MCP23S09T-E/P | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09T-E/SO | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09T-E/SS | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09TEMG | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09TEP | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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MCP23S09TESO | MICROCHIP | 8-Bit I/O Expander with Open-Drain Outputs |
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