是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | TO-92 |
包装说明: | PLASTIC, TO-92, 3 PIN | 针数: | 3 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 5.51 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | O-PBCY-T3 |
JESD-609代码: | e3 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 3 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TO-92 |
封装等效代码: | SIP3,.1,50 | 封装形状: | ROUND |
封装形式: | CYLINDRICAL | 峰值回流温度(摄氏度): | NOT APPLICABLE |
电源: | 1/5.5 V | 认证状态: | Not Qualified |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.06 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | THROUGH-HOLE |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
阈值电压标称: | +2.93V | 处于峰值回流温度下的最长时间: | NOT APPLICABLE |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MCP130-300FI/TO | MICROCHIP |
完全替代 |
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MCP130T-300I/TT | MICROCHIP |
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