5秒后页面跳转
MCM69R738CZP4.4R PDF预览

MCM69R738CZP4.4R

更新时间: 2024-01-22 06:09:18
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 内存集成电路静态存储器信息通信管理
页数 文件大小 规格书
20页 511K
描述
4M Late Write 2.5 V I/O

MCM69R738CZP4.4R 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.86最长访问时间:2.2 ns
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:4718592 bit
内存集成电路类型:LATE-WRITE SRAM内存宽度:36
功能数量:1端子数量:119
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:2.4 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.15 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:14 mm
Base Number Matches:1

MCM69R738CZP4.4R 数据手册

 浏览型号MCM69R738CZP4.4R的Datasheet PDF文件第2页浏览型号MCM69R738CZP4.4R的Datasheet PDF文件第3页浏览型号MCM69R738CZP4.4R的Datasheet PDF文件第4页浏览型号MCM69R738CZP4.4R的Datasheet PDF文件第5页浏览型号MCM69R738CZP4.4R的Datasheet PDF文件第6页浏览型号MCM69R738CZP4.4R的Datasheet PDF文件第7页 
Freescale Semiconductor, Inc.  
SEMICONDUCTOR TECHNICAL DATA  
MOTOROLA  
Order this document  
by MCM69R738C/D  
MCM69R738C  
MCM69R820C  
4M Late Write 2.5 V I/O  
The MCM69R738C/820C is a 4M–bit synchronous late write fast static RAM  
designed to provide high performance in secondary cache and ATM switch,  
Telecom, and other high speed memory applications. The MCM69R820C  
(organizedas256Kwordsby18bits)andtheMCM69R738C(organizedas128K  
words by 36 bits) are fabricated in Motorola’s high performance silicon gate  
BiCMOS technology.  
The differential clock (CK) inputs control the timing of read/write operations of  
theRAM. AttherisingedgeofCK, alladdresses, writeenables, andsynchronous  
selects are registered. An internal buffer and special logic enable the memory to  
accept write data on the rising edge of CK, a cycle after address and control  
signals. Read data is also driven on the rising edge of CK.  
ZP PACKAGE  
PBGA  
CASE 999–02  
The RAM uses 2.5 V inputs and outputs.  
The synchronous write and byte enables allow writing to individual bytes or the  
entire word.  
Byte Write Control  
Single 3.3 V +10%, –5% Operation  
2.5 V I/O (V  
)
DDQ  
Register to Register Synchronous Operation  
Asynchronous Output Enable  
Boundary Scan (JTAG) IEEE 1149.1 Compatible  
Differential Clock Inputs  
Optional x18 or x36 Organization  
MCM69R738C/820C–4 = 4 ns  
MCM69R738C/820C–4.4 = 4.4 ns  
MCM69R738C/820C–5 = 5 ns  
MCM69R738C/820C–6 = 6 ns  
Sleep Mode Operation (ZZ Pin)  
119–Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Plastic Ball Grid Array  
(PBGA) Package  
REV 1  
8/13/99  
Motorola, Inc. 1999  
For More Information On This Product,  
Go to: www.freescale.com  

与MCM69R738CZP4.4R相关器件

型号 品牌 获取价格 描述 数据表
MCM69R738CZP4R FREESCALE

获取价格

4M Late Write 2.5 V I/O
MCM69R738CZP5 FREESCALE

获取价格

4M Late Write 2.5 V I/O
MCM69R738CZP5R FREESCALE

获取价格

4M Late Write 2.5 V I/O
MCM69R738CZP6 FREESCALE

获取价格

4M Late Write 2.5 V I/O
MCM69R738CZP6R FREESCALE

获取价格

4M Late Write 2.5 V I/O
MCM69R738ZP6R MOTOROLA

获取价格

128KX36 CACHE SRAM, 3ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
MCM69R818A MOTOROLA

获取价格

Memory Products
MCM69R818AZP5 MOTOROLA

获取价格

4M Late Write HSTL
MCM69R818AZP5R MOTOROLA

获取价格

4M Late Write HSTL
MCM69R818AZP6 MOTOROLA

获取价格

4M Late Write HSTL