Datasheet > MCI0603TN9N1HHBP

MCI0603TN9N1HHBP

更新时间： 2024-04-09 18:56:52

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
10页	543K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 9.1, 14, 250mA

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MCI0603TN9N1HHBP 数据手册

浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第10页

11. Reliability Performance

Item

Test Condition

Requirements

1. No mechanical damage

2. Inductance value should

be within ± 10 % of the

initial value

1. Temperature : -55 ~ +125℃

2. Cycle : 100 cycles

3. Dwell time : 30minutes

Thermal Shock

4. Measurement : at ambient temperature

24 hrs after test completion

3. Q value should be within

± 20% of the initial value

1. No mechanical damage

2. Inductance value should

be within ± 10 % of the

initial value

3. Q value should be within

± 20% of the initial value

1. Temperature: 125 ± 5℃

2. Testing time: 1000 hrs

Operational Life 3. Applied current: Full rated current

4. Measurement: At ambient temperature

24 hours after test completion

1. No mechanical damage

2. Inductance value should

be within ± 10 % of the

initial value

3. Q value should be within

± 20% of the initial value

1. Temperature : 40℃ ± 2℃

2. Humidity : 90 ~ 95 % RH

3. Test time : 1000 hrs

4. Apply current : full rated current

5. Measurement : at ambient temperature

24 hrs after test completion

Biased Humidity

1. More than 95 % of

terminal electrode should

be covered with new

solder

2. Inductance value should

be within ± 10 % of the

initial value

1. Solder temperature : 260 ± 5℃

2. Flux : Rosin

3. DIP time : 10 ± 1 sec

Resistance to

Solder Heat

3. Q value should be within

± 20% of the initial value

1. More than 95 % of

terminal electrode should

be covered with new

solder

1. Solder temperature : 235 ± 5℃

2. Flux : Rosin

3. DIP time : 5 ± 1 sec

Solderability

2. No mechanical damage

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