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MCI0603TN9N1HHBP PDF预览

MCI0603TN9N1HHBP

更新时间: 2024-04-09 18:56:52
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
10页 543K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 9.1, 14, 250mA

MCI0603TN9N1HHBP 数据手册

 浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第4页浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第5页浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第6页浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第7页浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第8页浏览型号MCI0603TN9N1HHBP的Datasheet PDF文件第9页 
Item  
Test Condition  
Requirements  
1. Solder the chip to test jig then apply a  
force in the direction shown in below.  
2. The soldering shall be done with the  
reflow method and shall be conducted  
with care so that the soldering is uniform  
and free of defects such as heat shock.  
Bending Strength  
No mechanical damage  
NOTE  
The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid  
exposing the product to saline moisture. If the product is exposed to such atmospheres,  
the terminals will oxidize and solderability will be affected.  
Page 10 of 10  

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