是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | TSSOP, TSSOP14,.25 | 针数: | 14 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 2 weeks | 风险等级: | 1.52 |
模拟集成电路 - 其他类型: | SPST | 最大输入电压: | 5.5 V |
最小输入电压: | JESD-30 代码: | R-PDSO-G14 | |
JESD-609代码: | e4 | 长度: | 5 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 4 | 端子数量: | 14 |
标称断态隔离度: | 40 dB | 通态电阻匹配规范: | 20 Ω |
最大通态电阻 (Ron): | 120 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP14,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
座面最大高度: | 1.2 mm | 最大信号电流: | 0.025 A |
最大供电电流 (Isup): | 0.04 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 最长断开时间: | 45 ns |
最长接通时间: | 37 ns | 切换: | MAKE-BEFORE-BREAK |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
宽度: | 4.4 mm |
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