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MC74HCT374ADW-TR PDF预览

MC74HCT374ADW-TR

更新时间: 2024-11-25 13:11:19
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 总线驱动器总线收发器触发器逻辑集成电路光电二极管
页数 文件大小 规格书
7页 196K
描述
D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDSO20

MC74HCT374ADW-TR 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SOP, SOP20,.4Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-PDSO-G20
JESD-609代码:e0负载电容(CL):50 pF
逻辑集成电路类型:D FLIP-FLOP最大频率@ Nom-Sup:20000000 Hz
最大I(ol):0.006 A功能数量:8
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP20,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TAPE AND REEL
电源:5 V认证状态:Not Qualified
子类别:FF/Latches标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL触发器类型:POSITIVE EDGE
Base Number Matches:1

MC74HCT374ADW-TR 数据手册

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SEMICONDUCTOR TECHNICAL DATA  
J SUFFIX  
CERAMIC PACKAGE  
CASE 732–03  
20  
20  
High–Performance Silicon–Gate CMOS  
1
The MC54/74HCT374A may be used as a level converter for  
interfacing TTL or NMOS outputs to High–Speed CMOS inputs.  
The HCT374A is identical in pinout to the LS374.  
N SUFFIX  
PLASTIC PACKAGE  
CASE 738–03  
Data meeting the setup and hold time is clocked to the outputs with the  
rising edge of Clock. The Output Enable does not affect the state of the  
flip–flops, but when Output Enable is high, the outputs are forced to the  
high–impedance state. Thus, data may be stored even when the outputs  
are not enabled.  
The HCT374A is identical in function to the HCT574A, which has the  
input pins on the opposite side of the package from the output pins. This  
device is similar in function to the HCT534A, which has inverting outputs.  
1
DW SUFFIX  
SOIC PACKAGE  
CASE 751D–04  
20  
20  
20  
1
SD SUFFIX  
SSOP PACKAGE  
CASE 940C–03  
1
DT SUFFIX  
TSSOP PACKAGE  
CASE 948E–02  
Output Drive Capability: 15 LSTTL Loads  
TTL/NMOS–Compatible Input Levels  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 4.5 to 5.5 V  
Low Input Current: 1.0 µA  
1
ORDERING INFORMATION  
MC54HCTXXXAJ  
MC74HCTXXXAN  
MC74HCTXXXADW  
MC74HCTXXXASD  
MC74HCTXXXADT  
Ceramic  
Plastic  
SOIC  
SSOP  
TSSOP  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
Chip Complexity: 276 FETs or 69 Equivalent Gates  
Improvements over HCT374  
— Improved Propagation Delays  
— 50% Lower Quiescent Power  
— Improved Input Noise and Latchup Immunity  
PIN ASSIGNMENT  
OUTPUT  
ENABLE  
1
20  
V
CC  
LOGIC DIAGRAM  
Q0  
D0  
D1  
2
3
4
19  
18  
17  
Q7  
D7  
D6  
2
5
3
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
D0  
D1  
D2  
D3  
D4  
4
Q1  
Q2  
5
16  
15  
14  
13  
12  
11  
Q6  
6
7
6
Q5  
9
8
DATA  
INPUTS  
NONINVERTING  
OUTPUTS  
D2  
7
D5  
13  
14  
17  
18  
12  
15  
16  
D3  
8
D4  
D5  
D6  
D7  
Q3  
9
Q4  
GND  
10  
CLOCK  
19  
Q7  
11  
CLOCK  
FUNCTION TABLE  
PIN 20 = V  
PIN 10 = GND  
CC  
Inputs  
Output  
1
OUTPUT ENABLE  
Output  
Enable Clock  
D
Q
Design Criteria  
Internal Gate Count*  
Value  
Units  
L
L
H
L
X
X
H
69  
1.5  
ea.  
L
No Change  
Z
L
H
L,H,  
X
Internal Gate Propagation Delay  
Internal Gate Power Dissipation  
ns  
µW  
pJ  
5.0  
X = don’t care  
Z = high impedance  
Speed Power Product  
.0075  
* Equivalent to a two–input NAND gate.  
2/97  
REV 7  
Motorola, Inc. 1997  

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