Freescale
AO6701 /MC6701
P-Channel 20-V (D-S) MOSFET With Schottky Diode
MOSFET PRODUCT SUMMARY
V (V)
DS
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low
rDS(on) and to ensure minimal power loss and heat
dissipation. Typical applications are DC-DC
converters and power management in portable and
battery-powered products such as computers,
printers, PCMCIA cards, cellular and cordless
telephones.
rDS(on) (OHM)
GS
ID (A)
0.130 @V = -4.5V ±2.5
-20
0.190 @V = -2.5V ±1.9
GS
SCHOTTKY PRODUCT SUMMARY
V (V)
f
Diode ForwardVoltage
0.48V@1.0A
V (V)
KA
IF(A)
1.0
20
•
•
Low rDS(on) provides higher efficiency and
extends battery life
Low thermal impedance copper leadframe
TSOP-6 saves board space
TSOP-6
S
K
A
Top View
1
A
6
5
4
K
G
S
2
3
N/C
D
•
•
Fast switching speed
High performance trench technology
D
G
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA= 25 oC UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage (MOSFET)
Reverse Voltage (Schottky)
Symbol Maximum Units
VDS
VKA
VGS
-20
20
±8
±2.5
±1.9
V
Gate-Source Voltage (MOSFET)
o
TA=25 C
o
Continuous Drain Current (T =150 C) (MOSFET)a
ID
J
o
TA=70 C
Pulsed Drain Current (MOSFET)b
±10
-1.6
0.5
8
1.15
0.7
IDM
IS
IF
A
Continuous Source Current (MOSFET Diode Conduction)a
Average Forward Current (Schottky)
Pulsed Forward Current (Schottky)
IFM
o
TA=25 C
MaximumPower Dissipation (MOSFET)a
o
TA=70 C
PD
W
oC
o
TA=25 C
1.0
0.6
MaximumPower Dissipation (Schottky)a
o
TA=70 C
Operating Junction and Storage Temperature Range
T, T -55 to 150
J
stg
THERMAL RESISTANCE RATINGS
Parameter
Typ
Max
110
150
Symbol
RthJA
t <= 10 sec
93
Maximum Junction-to-Ambienta
oC/W
Steady State
130
Notes
a.
b.
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature
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