MC56F82746VLFR PDF预览

MC56F82746VLFR

更新时间: 2025-08-21 18:16:15
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
76页 1323K
描述
32-bit DSC, 56800EX core, 64KB Flash, 100MHz, QFP 48

MC56F82746VLFR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred包装说明:LQFP-48
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.76
具有ADC:YES地址总线宽度:
位大小:32最大时钟频率:50 MHz
DAC 通道:YESDMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PQFP-G48
JESD-609代码:e3湿度敏感等级:3
I/O 线路数量:39端子数量:48
片上程序ROM宽度:8最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装形状:SQUARE封装形式:FLATPACK
峰值回流温度(摄氏度):260RAM(字节):8192
ROM(单词):65536ROM可编程性:FLASH
速度:100 MHz最大供电电压:3.6 V
最小供电电压:2.7 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN
端子形式:GULL WING端子位置:QUAD
处于峰值回流温度下的最长时间:40uPs/uCs/外围集成电路类型:MICROCONTROLLER

MC56F82746VLFR 数据手册

 浏览型号MC56F82746VLFR的Datasheet PDF文件第2页浏览型号MC56F82746VLFR的Datasheet PDF文件第3页浏览型号MC56F82746VLFR的Datasheet PDF文件第4页浏览型号MC56F82746VLFR的Datasheet PDF文件第5页浏览型号MC56F82746VLFR的Datasheet PDF文件第6页浏览型号MC56F82746VLFR的Datasheet PDF文件第7页 
Document Number MC56F827XXDS  
Rev. 4.1, 11/2018  
NXP Semiconductors  
Data Sheet: Technical Data  
MC56F827XXDS  
MC56F827xx  
Supports MC56F82748VLH,  
MC56F82748MLH, MC56F82746VLF,  
MC56F82746MLF, MC56F82743VLC,  
MC56F82743VFM, MC56F82738VLH,  
MC56F82736VLF, MC56F82733VLC,  
MC56F82733VFM, MC56F82733MFM,  
MC56F82728VLH, MC56F82726VLF,  
MC56F82723VLC, MC56F82723VFM  
Features  
• Analog  
– Two high-speed, 8-channel, 12-bit ADCs with  
dynamic x1, x2, and x4 programmable amplifier  
– Four analog comparators with integrated 6-bit DAC  
references  
• This family of digital signal controllers (DSCs) is  
based on the 32-bit 56800EX core. On a single chip,  
each device combines the processing power of a DSP  
and the functionality of an MCU, with a flexible set of  
peripherals to support many target applications:  
– Industrial control  
– Up to two 12-bit digital-to-analog converters (DAC)  
• One eFlexPWM module with up to 8 PWM outputs,  
including 8 channels with high resolution NanoEdge  
placement  
– Home appliances  
– Smart sensors  
– Wireless charging  
– Switched-mode power supply and power  
management  
– Power distribution systems  
– Motor control (ACIM, BLDC, PMSM, SR, stepper)  
– Photovoltaic systems  
• Communication interfaces  
– Up to two high-speed queued SCI (QSCI) modules  
with LIN slave functionality  
– Up to two queued SPI (QSPI) modules  
– One I2C/SMBus port  
– One Modular/Scalable Controller Area Network  
(MSCAN) module  
– Circuit breaker  
– Medical device/equipment  
– Instrumentation  
• Timers  
– Uninterruptible power supplies (UPS)  
– Lighting  
– One 16-bit quad timer (1 x 4 16-bit timer)  
– Two Periodic Interval Timers (PITs)  
• DSC based on 32-bit 56800EX core  
– Up to 100 MIPS at 100 MHz core frequency in fast  
mode  
• Security and integrity  
– Cyclic Redundancy Check (CRC) generator  
– Windowed Computer operating properly (COP)  
watchdog  
– DSP and MCU functionality in a unified, C-efficient  
architecture  
– External Watchdog Monitor (EWM)  
• On-chip memory  
• Clocks  
– Up to 64 KB flash memory  
– Two on-chip relaxation oscillators: 8 MHz (400 kHz  
at standby mode) and 200 kHz  
– Crystal / resonator oscillator  
– Up to 8 KB data/program RAM  
– On-chip flash memory and RAM can be mapped  
into both program and data memory spaces  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

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